GaN Talk a blog dedicated to crushing silicon
Term: 5th Gen
2 post(s) found

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET
Sep 22 2020

Efficient Power Conversion (EPC) is increasing the performance distance between the aging silicon power MOSFET and eGaN transistors with 100 V ratings.  The new fifth-generation “plus” devices have about 20% lower RDS(on) and increased DC ratings compared with the prior fifth-generation products.  This performance boost comes from the addition of a thick metal layer and a conversion from solder balls to solder bars.

New 200 V eGaN Devices Double the Performance Edge Over the Aging Silicon Power MOSFET.

New 200 V eGaN Devices Double the Performance Edge Over the Aging Silicon Power MOSFET.
Aug 21 2020

Efficient Power Conversion (EPC) is doubling the performance distance between the aging silicon power MOSFET and eGaN® transistors with 200 V ratings.  The new fifth-generation devices are about half the size of the prior generation.  This performance boost comes from two main design differences, as shown in figure 1.  On the left is a cross-section of the fourth generation 200 V enhancement-mode GaN-on-Si process.  The cross-section on the right is the fifth-generation structure with reduced distance between gate and source electrodes and an added thick metal layer. These improvements, plus many others not shown, have doubled the performance of the new-generation FETs.