Speaker: Dr. Shengke Zhang is Vice President of Product Reliability at EPC, where he leads the conduction of failure analyses for all GaN transistors and ICs. Prior to joining EPC, he worked as Sr. Failure Analysis Engineer on RF-MEMS devices in the mobile industry. He earned his Ph.D. degree in Materials Science and Engineering from Arizona State University in 2016, under Dr. Nathan Newman, in investigating low-loss dielectrics for cellular and advanced computing applications. He received his B.S. degree from Huazhong University of Science and Technology 2011. He was the author and co-author of more than 20 technical papers. He is also a committee member and internal liaison for JEDEC's JC-70 Wide Bandgap Power Electronic Conversion Semiconductors Committee.