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GaN正式登场,传统功率器件将被替代

MOSFET、IGBT可以休矣,即将成为过去,在这个250亿美元的市场取而代之的将是GaN功率器件——这是EPC首席执行官Alex Lidow日前在接受EDN China专访时的说法。Lidow博士之前在IR担任了12年CEO,在2007年他创立了宜普电源转换公司(Efficient Power Conversion Corporation,EPC),他在斯坦福大学的博士论文就是关于HEXFET功率MOSFET的,是相关专利的发明者之一。在HEXFET专利过期之前,相关版税已超过9亿美元。

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分类: 访问文稿

Darnell Power forum looks at GaN transistor technology

The weather was perfect in Chi-town at the Darnell Power Forum but the technologies were hot including a talk by Alex Lidow CEO of Efficient Power Conversion Corp., who discussed why the power industry should consider GaN for improving performance.

By Paul O’Shea
EEBEAT
September 14, 2010

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Driving eGaN™ Transistors for Maximum Performance

The recent introduction of enhancement mode GaN transistors (eGaN™) as power MOSFET/ IGBT replacements in power management applications enables many new products that promise to add great system value. In general, an eGaN transistor behaves much like a power MOSFET with a quantum leap in performance, but to extract all of the newly-available eGaN transistor performance requires designers to understand the differences in drive requirements. By Johan Strydom and Alex Lidow September, 2010 Read the article 阅读全文
分类: 技术文章

硅功率MOSFET 是否行将就木?

人们对于电能的需求永无止境,功率MOSFET在结构、技术和电路拓扑上的创新也一刻未停,但电源管理效率和成本的挑战也一直加码。硅功率MOSFET的物理极限似乎限制了其继续满足挑战的能力,以GaN为主的新材料工艺技术的发展似乎大有取而代之的势头。

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eGaN™-Silicon Power Shoot-Out: Part 1 Comparing Figure of Merit (FOM)

One yardstick to compare enhancement mode GaN (eGaN) power devices with state-of-the-art silicon MOSFETs is FOM. However, beyond these pure mathematical numbers, there are other device and package related parameters that significantly influence in-circuit performance.

By Johan Strydom PHD, Director of Application Engineering, EPC
Power Electronics Technology
September 1, 2010

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分类: 技术文章
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