新闻

客户可以在我们的网页 注册 ,定期收取最新消息包括全新产品发布、应用文章及更多其它资讯。如果你错过了已发布的资料,你可浏览以下的文档。

Thermal Management of Chip-Scale GaN Devices

分类: Articles
Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increase power density, especially with chip-scale packaging (CSP). What is sometimes overlooked, however, is that CSP eGaN® power FETs and integrated circuits have excellent thermal performance when mounted on standard printed circuit board (PCBs) with simple methods for attaching heat sinks. Simulations, supported by experimental verification, examine the effect of various parameters and heat flow paths to provide guidance on designing for performance versus cost.

Bodo’s Power Systems
February, 2021
Read article