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Reduce Audible Noise in Motor Drive Designs Using eGaN FETs and ICs

Reduce Audible Noise in Motor Drive Designs Using eGaN FETs and ICs
一月 15 2021

Brushless DC (BLDC) motors are popular and finding increasing application in robotics, e-mobility, and drones. Such applications have special requirements such as lightweight, small size, low torque ripple, low audible noise, and extreme precision control.  To address these needs, the inverters powering the motors need to operate at higher frequency but require advanced techniques to reduce the resultant higher power loss. Enhancement-mode gallium nitride (eGaN ®) transistors and integrated circuits offer the ability to operate at much higher frequencies without incurring significant losses. 

How to Design a Bi-Directional 1/16th Brick 48 V-12 V Converter Using Monolithic GaN ePower™ Stage

How to Design a Bi-Directional 1/16th Brick 48 V-12 V Converter Using Monolithic GaN ePower™ Stage
十二月 15 2020

Brick DC-DC converters are widely used in data center, telecommunication and automotive applications, converting a nominal 48 V bus to (or from) a nominal 12 V bus. Advances in GaN integrated circuit (IC) technology have enabled the integration of the half bridge and gate drivers, resulting in a single chip solution that simplifies layout, minimizes area, and reduces cost.

This application note discusses the design of a digitally controlled bi-directional 1/16th brick converter using the integrated GaN power stage for 48 V-to-12 V application, with up to 300 W output power, and peak efficiency of 95%.

The standard dimension of the 1/16th brick converter is 33 x 22.9 mm (1.3 x 0.9 inch). The height limit for this design is set to 10 mm (0.4 inch).

How to Design a Highly Efficient, 2.5 kW, Universal Input Voltage Range, Power Factor Correction (PFC) 400 V Rectifier Using 200 V eGaN® FETs

How to Design a Highly Efficient, 2.5 kW, Universal Input Voltage Range, Power Factor Correction (PFC) 400 V Rectifier Using 200 V eGaN<sup>®</sup> FETs
十一月 03 2020

Acknowledgement - This application note and associated hardware was developed in collaboration with Semiconductor Power Electronics Center (SPEC) at University of Texas at Austin.

Motivation

The expansion of applications such as cloud computing, wearables, machine learning, autonomous driving, and IoT drive us towards an even more data-intensive world, increasing demands on data centers and power consumption [1, 2]. The importance of efficiency, power density, and cost of the AC to DC switching power supply is driving innovative solutions that eGaN FETs can solve to yield ultra-high efficiency power factor correction (PFC) front-end rectifier solutions that are the focus of this how-to-application note.

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET
九月 22 2020

Efficient Power Conversion(EPC)は、定格100 Vの成熟したシリコン・パワーMOSFETとeGaNトランジスタの間の性能の差を広げています。新しい第5世代「プラス」デバイスは、以前の第5世代製品と比べて、オン抵抗RDS(on)が約20%小さく、直流定格が高くなっています。この性能向上は、厚い金属層の追加と、はんだボールから、はんだバーへの変更によるものです。

New 200 V eGaN Devices Double the Performance Edge Over the Aging Silicon Power MOSFET.

New 200 V eGaN Devices Double the Performance Edge Over the Aging Silicon Power MOSFET.
八月 21 2020

Efficient Power Conversion (EPC) is doubling the performance distance between the aging silicon power MOSFET and eGaN® transistors with 200 V ratings.  The new fifth-generation devices are about half the size of the prior generation.  This performance boost comes from two main design differences, as shown in figure 1.  On the left is a cross-section of the fourth generation 200 V enhancement-mode GaN-on-Si process.  The cross-section on the right is the fifth-generation structure with reduced distance between gate and source electrodes and an added thick metal layer. These improvements, plus many others not shown, have doubled the performance of the new-generation FETs.

Why GaN in Space?

Why GaN in Space?
六月 28 2020

Packaged SEE Immune and Radiation Hardened enhancement mode gallium nitride (eGaN) devices offer dramatically improved performance over the aging Rad Hard silicon MOSFET, enabling a new generation of power converters in space operating at higher frequencies, higher efficiencies, and greater power densities than ever achievable before.

eGaN FETs Are Low EMI Solutions!

eGaN FETs Are Low EMI Solutions!
五月 19 2020

GaN FETs can switch significantly faster than Si MOSFETs causing many system designers to ask − how does higher switching speeds impact EMI?

This blog discusses simple mitigation techniques for consideration when designing switching converter systems using eGaN® FETs and will show why GaN FETs generate less EMI than MOSFETs, despite their fast-switching speeds.

ePower™ Stage – Redefining Power Conversion

ePower™ Stage – Redefining Power Conversion
三月 16 2020

Beyond just performance and cost improvement, the most significant opportunity for GaN technology to impact the power conversion market comes from its intrinsic ability to integrate multiple devices on the same substrate. GaN technology, as opposed to standard silicon IC technology, allows designers to implement monolithic power systems on a single chip in a more straightforward and cost-effective way.

Today, the most common building block used in power conversion is the half bridge. In 2014, EPC introduced a family of integrated half-bridge devices which became the starting point for the journey towards a power system-on-a-chip. This trend was expanded with the introduction of the EPC2107 and EPC2108, which integrated half bridges with integrated synchronous bootstrap. In 2018 we further continued the integration path with the introduction of eGaN ICs combining gate drivers with high-frequency GaN FETs in a single chip for improved efficiency, reduced size, and lower cost. Now, the ePower™ Stage IC family redefines power conversion by integrating all functions in a single GaN-on-Si integrated circuit at higher voltages and higher frequency levels beyond the reach of silicon.

eGaN vs. Silicon

eGaN vs. Silicon
一月 23 2020

This post was originally published by Dr. John Glaser & Dr. David Reusch on June 13, 2016 on the Power Systems Design web site.

Comparing Dead-time Losses for eGaN FETs and Silicon MOSFETs in Synchronous Rectifiers

There have been several comparisons of eGaN FETs with silicon MOSFETs in a variety of applications, including hard-switched, soft-switched, and high-frequency power conversion. These studies have shown that eGaN FETs have large efficiency and power density advantages over silicon MOSFETs. Here we’ll focus on the use of eGaN FETs in synchronous rectifier (SR) applications and the importance of dead-time management. We show that eGaN FETs can dramatically reduce loss due to dead-time in synchronous rectifiers above and beyond the benefits of low RDS(on)and charge.

2020 New Year with GaN

2020 New Year with GaN
一月 02 2020

Dear Friends, colleagues and partners of EPC,

Happy New Year to you and your family from all of us at EPC!

2019 was a year to remember for EPC’s GaN innovations and the multiple use cases for GaN that have come to fruition. EPC’s latest generation of GaN products have enabled engineers to gain power stage advantages due to their low RDS(on) characteristics, higher efficiency, enhanced thermal properties, small size and low cost. Now, more than ever, power system designers are switching from silicon devices to higher performance GaN components.