Learn how EPC’s new demo board, the EPC9176 with its six QFN-packaged GaN ICs allows for more efficient, high-performance vacuum cleaner motors.

氮化镓(GaN)器件是一种非常坚硬和在机械方面非常稳定的宽带隙半导体材料，用于生产功率器件、射频元件和发光二极管 (LED)。其开关频率远高于硅器件，使电力电子设计人员能够利用氮化镓器件创建更小、更高效、性能更高的系统，这是以前采用硅技术难以实现。

GaN is a game changer for motor drive applications. For designers to take advantage of this technology, fast and reliable time-to-market is critical. Easy-to-use reference designs using state-of-the-art electronics and techniques provide a valuable tool to speed time to market. The EPC9173 tool allows designers of eBikes and drones to enhance motor system size, performance, range, precision, and torque, all while simplifying design for faster time-to-market.  

The EPC9173 integrates all the necessary circuits to operate a 3-phase BLDC motor with high performance, 48 V input, 1.5kW output, and three-phase inverter using six EPC23101  GaN ICs. Thanks to the high-power density and the high electrical conductivity of GaN ICs, the EPC9173 delivers up to 25 A_RMS on each leg and supports PWM switching frequencies up to 250 kHz under a natural convection passive heatsink. The resultant quality of the current output waveforms, lesser torque oscillations, and total system efficiency increase the performance of the motor-drive system. Further, the extremely small size of this inverter allows integration into the motor housing resulting in the lowest EMI, highest density, and lowest weight.

APEC is The Premier Global Event in Applied Power Electronics

Preparations are well underway for EPC to head to Houston for the Applied Power Electronics Conference (APEC). The team is excited to be back, in-person exhibiting a large variety of demonstrations showcasing how the superior performance of GaN is transforming the delivery of power across many industries, including computing, communications, and e-mobility.

Here’s a sneak peek at some of the key application areas we will be showcasing in Booth 1302 at APEC.

This GaN Talk blog discusses the advantages of using GaN-based inverters instead of silicon-based inverters for motor drive designs to operate smoother while reducing size and weight. These advantages are critical for motor drives used in typical applications such as warehousing & logistical robots, servo drives, e-bikes & e-scooters,  collaborative and low voltage robots and medical robotics, industrial drones, and automotive motors.

Omdia forecasts that worldwide shipments of warehousing and logistics robots will grow rapidly over the next 5 years from 194,000 units in 2018 to 938,000 units annually by 2022, with the rate of growth slowing after 2021 as many major players will have adopted robotic systems by then.  Worldwide revenue for this category will increase from $8.3 billion in 2018 to $30.8 billion in 2022, providing significant opportunities for established participants and emerging players.

Rethinking the Ordinary and Overcoming Mental Biases

Motor drive applications span several markets: industrial, appliance, and automotive. A commonality that occurs regardless of market is that when a new technology is proposed, it faces resistance to its adoption; after all, it is human nature to stick with what is known and resist change.

Brushless DC (BLDC) motors are popular and finding increasing application in robotics, e-mobility, and drones. Such applications have special requirements such as lightweight, small size, low torque ripple, low audible noise, and extreme precision control.  To address these needs, the inverters powering the motors need to operate at higher frequency but require advanced techniques to reduce the resultant higher power loss. Enhancement-mode gallium nitride (eGaN ^®) transistors and integrated circuits offer the ability to operate at much higher frequencies without incurring significant losses. 

Packaged SEE Immune and Radiation Hardened enhancement mode gallium nitride (eGaN) devices offer dramatically improved performance over the aging Rad Hard silicon MOSFET, enabling a new generation of power converters in space operating at higher frequencies, higher efficiencies, and greater power densities than ever achievable before.

Beyond just performance and cost improvement, the most significant opportunity for GaN technology to impact the power conversion market comes from its intrinsic ability to integrate multiple devices on the same substrate. GaN technology, as opposed to standard silicon IC technology, allows designers to implement monolithic power systems on a single chip in a more straightforward and cost-effective way.

Today, the most common building block used in power conversion is the half bridge. In 2014, EPC introduced a family of integrated half-bridge devices which became the starting point for the journey towards a power system-on-a-chip. This trend was expanded with the introduction of the EPC2107 and EPC2108, which integrated half bridges with integrated synchronous bootstrap. In 2018 we further continued the integration path with the introduction of eGaN ICs combining gate drivers with high-frequency GaN FETs in a single chip for improved efficiency, reduced size, and lower cost. Now, the ePower™ Stage IC family redefines power conversion by integrating all functions in a single GaN-on-Si integrated circuit at higher voltages and higher frequency levels beyond the reach of silicon.