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EPC GaN FET助力DC/DC转换器实现高功率密度和高效率基准

EPC GaN FET助力DC/DC转换器实现高功率密度和高效率基准

EPC GaN FET与Analog Devices驱动器和控制器相结合,为客户简化氮化镓基设计、提高其效率、降低散热成本、助力计算、工业和消费类应用的DC/DC转换器实现最高功率密度。

宜普电源转换公司(EPC )宣布推出采用 EPC GaN FET 和 Analog Devices, Inc. (ADI) 控制器的各种参考设计。

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EPC GaN FET配以ADI控制器可实现最高功率密度稳压DC/DC转换器

EPC GaN FET配以ADI控制器可实现最高功率密度稳压DC/DC转换器

宜普电源转换公司(EPC)和Analog Devices(ADI)公司携手新推的参考设计采用经过全面优化的新型模拟控制器来驱动EPC的氮化镓场效应晶体管,可实现超过96.5%的效率。

宜普电源转换公司(EPC)宣布新推EPC9158,这是一款工作在500 kHz开关频率的双输出同步降压转换器参考设计,可将48 V~54 V的输入电压转换为12 V稳压输出,可提供高达每相25 A电流或50 A总连续电流。ADI的新型LTC7890同步氮化镓降压控制器与EPC的超高效GaN FET相结合,可为高功率密度应用提供占板面积小且非常高效的解决方案。该解决方案在48 V/12 V 、50 A连续电流下可实现 96.5%的效率。

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Podcast: electronica 2022 preview

Podcast:  electronica 2022 preview

From Nov. 15 to 18, electronica 2022 will bring the international electronics industry together at the Munich exhibition grounds. Wide Bandgap Semiconductors, Renewable Energies, Smart Grid, and Energy Storage will be the major topics covered by the Power Electronics Forum at electronica 2022. In this podcast, onsemi president and CEO Hassane El-Khoury, Silanna Semiconductor North America CEO Mark Drucker, and of Efficient Power Conversion (EPC) CEO Alex Lidow will introduce the Power Electronics Forum. Interview with Alex Lidow starts at 31:55

EETimes
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EPC Opens New Motor Drive Center of Excellence

EPC Opens New Motor Drive Center of Excellence

New Motor Drive Center of Excellence (CoE) design center in Turin, Italy, to help customers exploit the power of GaN for growing motor drive applications

EL SEGUNDO, Calif.— September, 2022 —   EPC has opened a new design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets.  The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW.

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Podcast: How is GaN Powering Wireless Charging Advances?

Podcast: How is GaN Powering Wireless Charging Advances?

Join host Dr. Sanjay Gupta and guest Alex Lidow, CEO of Efficient Power Conversion – or EPC – in episode 5 as they explore the ways GaN is advancing the future of wireless charging. As wireless power increases in maturity and adoption, the industry needs solutions that improve performance, efficiency, and user experience. Gallium Nitride is essential to enabling higher power applications than can be achieved with traditional silicon, opening the door for charging multiple devices and more diverse devices, such as laptops, drones, robots, power tools, eBikes, and industrial equipment. Wireless charging circuits employing GaN transistors are also five to ten times smaller than silicon devices able to handle the same power levels.

AirFuel Alliance
May, 2022
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Sensitron and EPC Collaborate to Introduce a High-Power Density 350 V Gallium Nitride (GaN) Half Bridge Intelligent Power Module (IPM) That is 60% Smaller Than Comparable Silicon Solutions and Lower C

Sensitron and EPC Collaborate to Introduce a High-Power Density 350 V Gallium Nitride (GaN) Half Bridge Intelligent Power Module (IPM) That is 60% Smaller Than Comparable Silicon Solutions and Lower C

Sensitron introduces the SPG025N035P1B GaN half-bridge module using the 350 V EPC2050 eGaN® FET from Efficient Power Conversion (EPC)

EL SEGUNDO, Calif.— May 2022, Reducing size and cost were key concerns of Sensitron when designing their latest generation GaN power modules. By replacing traditional silicon FETs with EPC’s 350 V, EPC2050 GaN FET, Sensitron was able to reduce the size of their solution by 60% while also improving the module’s already excellent junction-to-case thermal conduction. The SPG025N035P1B from Sensitron is a high-power density 350 V, 20 A GaN half bridge with an integrated gate drive, optimized for stray inductance and switching performance at 500 khz. Rated at 20 A, the module can be used to control over 3 kW. Sensitron’s proprietary topside cooling technology on this ultra-small, lightweight high power density package (1.10" x 0.70" x 0.14") allows for optimal thermal performance. The SPG025N035P1B was designed for commercial, industrial, and aerospace applications.

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