As more processing power and more complex loads are placed on-orbit or into deep space missions, it is sometime necessary to parallel two or more power switches. However, conventional power device packages, such as the FSMD-A/B/C/D and their I/O pad provisioning make it difficult to accomplish paralleling these devices in a performance-conscious manner. When paralleled, the gate and source-sense pads on these packages either serve to block the most efficient/shortest interconnect from package-to-package for the drain and source connections or for the gate and source-sense pads. So in parallel configurations, there is always a compromise between optimized drain-source load-circuit performance and gate-source-sense drive-loop performance. This article introduces the FSMD-G discrete HEMT package and explains how the reconfiguration of its I/O pads overcomes these limitations when paralleling GaN HEMTs.

How2Power
September, 2023
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Since the launch of GaN-on-Si enhancement mode power transistors in March 2010 there has been a slow but monotonic shift towards adoption and replacement of silicon-based power MOSFETs. Initial adoption came from risk-taker visionaries in applications such as lidar, high-end audio amplifiers, robots, vehicle headlamps, and high-performance DC-DC converters. For the expansion of GaN for power conversion to get beyond the early adopters, a more user-friendly format than the WLCP needed to be developed. This format, however, needed to preserve the key attributes of small size, low RDS(on), high speed, excellent thermal conductivity, and low cost. In other words, the best package would be the least amount of package technically possible. Enter the PQFN…

Bodo’s Power Systems
March, 2023
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采访视频 - 宜普电源转换公司的首席执行官 Alex Lidow与Electronic Design媒体讨论了氮化镓技术的未来发展、普及率及其在电源供电和其他技术中的应用。

Electronic Design
2022年3月
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宜普电源转换公司首席执行官兼共同创办人Alex Lidow于APEC 2019展览会的Ridley Engineering展览摊位进行演讲，题目是“硅已经死亡”。

When the issue invariably turns to the packaging of the power semiconductor – transistor, diode, or integrated circuit – the requests for improvement fall into six categories:

1. Can you make the package smaller?
2. Can you reduce the package inductance?
3. Can you make the product with lower conduction losses?
4. Can you make the package more thermally efficient?
5. Can you sell the product at a lower price?
6. Can you make the package more reliable?

随着功率转换器需要更高的功率密度，晶体管必须配合不断在缩减的电路板面积。氮 化镓（GaN）功率晶体管除了可以提高电源效率外，它们也必须具备更高的热效率。在 这篇文章中，我们探讨采用芯片级封装的增强型氮化镓场效应晶体管（eGaN ^®FET） 的热性能，并与最先进的Si MOSFET比较两种器件的电气性能和热性能。

Bodo's China
2016年10月
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With power converters demanding higher power density, transistors must be accommodated in an ever decreasing board space. Beyond gallium nitride based power transistors’ ability to improve electrical efficiency, they must also be more thermally efficient. This article evaluates the thermal performance of chip-scale packaged eGaN^® FETs and compares their in-circuit electrical and thermal performance with state-of-the-art silicon MOSFETs.

Bodo’s Power Systems
David Reusch, Ph.D. and Alex Lidow, Ph.D.
June 1, 2016
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在开关频率10 MHz或以上，电源转换需要具备高速开关的晶体管并配备在高频工作的封装。相比日渐老龄化的功率MOSFET器件，由于氮化镓场效应晶体管（eGaN® FET）提供无可匹敌的器件性能及封装，因此可以在高频时提高电源转换效率。

Bodo’s Power Systems
客席编辑： Alex Lidow
2013年11月

宜普公司David Reusch谈论增强型氮化镓器件及没有使用封装以减少损耗

Electronic Products
2013年10月
http://bcove.me/ukn7dtt1

封装的缺点是增加功率MOSFET器件的尺寸及成本，并增加阻抗和电感，从而降低器件的性能。宜普电源转换公司Alex Lidow辩说最有效的解决方案是不用封装，使 氮化镓高电子迁移率晶体管与等效硅器件相比，具有相同成本的优势。

杂志：Compound Semiconductor
日期：２０１３年6月