Design DC-DC Converters with Higher Efficiency, Smaller Size, and Lower Cost with Useful GaN-Based Reference Designs
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Emerging computing applications demand more power in much smaller form factors. In addition to the expanding needs of the server market, some of the most challenging applications are multi-user gaming systems, autonomous cars, and artificial intelligence. Additionally, automotive systems are moving from 12 V distribution systems to 48 V systems. This change is driven by the increase of power-hungry electronically driven functions and the emergence of autonomous vehicles creating additional demands from systems such as lidar, radar, camera, and ultrasonic sensors upon the power distribution system. In this webinar learn how GaN-based reference designs can help you meet the higher demands of today’s power converters across a myriad of applications, power demands, and topologies.
In this webinar, we'll discuss:
- EPC’s GaN FETs and ICs suitable for DC-DC conversion applications and accompanying reference designs and evaluation tools
- DC-DC reference designs for multiple topologies and power levels
- How to accelerate the design process by utilizing EPC’s DC-DC reference designs
- Practical design considerations to prioritize performance metrics
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Presenter: Michael de Rooij received the B. Eng., M. Eng. and, D. Eng. degrees from the Rand Afrikaans University (Now The University of Johannesburg), Johannesburg, South Africa, in 1992, 1994 and 1998 respectively, all in electronics and electrical engineering with major in power electronics.
He is currently Vice President of Applications Engineering at Efficient Power Conversion Corporation (EPC) headquartered in El Segundo, CA, U.S.A. His experience covers highly resonant loosely coupled wireless power, high density DC to DC converters, GaN IC development, RF power amplifiers, solid-state high-frequency power converters and devices, utility applications of power electronics, uninterruptible power supplies, integration of power electronic converters, power electronic packaging, induction heating, photovoltaic converters, Magnetic Resonance Imaging (MRI) Systems and gate drivers with protection features.