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The reliability of DC-DC converters is essential for maintaining system performance, ensuring safety, minimizing costs and downtime, and promoting longevity and sustainability. This webinar will provide you with valuable insights and practical knowledge about the reliability of Gallium Nitride (GaN) technology in various DC-DC converter topologies.
During this webinar, we will explore the cutting-edge Test-to-Fail methodology and its significance in precisely predicting the projected lifetime of eGaN devices in some of the most common DC-DC converter topologies.
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Speaker: Dr. Shengke Zhang is Vice President of Product Reliability at EPC, where he leads the conduction of failure analyses for all GaN transistors and ICs. Prior to joining EPC, he worked as Sr. Failure Analysis Engineer on RF-MEMS devices in the mobile industry. He earned his Ph.D. degree in Materials Science and Engineering from Arizona State University in 2016, under Dr. Nathan Newman, in investigating low-loss dielectrics for cellular and advanced computing applications. He received his B.S. degree from Huazhong University of Science and Technology 2011. He was the author and co-author of more than 20 technical papers. He is also a committee member and internal liaison for JEDEC's JC-70 Wide Bandgap Power Electronic Conversion Semiconductors Committee.
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