How to GaN Webinar Series

How2GaN Summer Series

Thermal Management of GaN FETs

View Now: Register to receive a link to view a replay of the webinar

In the final installment of the four-part How2GaN Summer Series, our GaN Experts will focus on thermal management techniques to maximize the performance of GaN FETs and ICs. Topics covered include:

  • Thermal resistance device comparisons
  • The impact of using PCB only for heat spreading
  • Heat-spreader/sink attach overview
  • Thermal performance improvements with heat-spreader/sink

After registering, you will receive a confirmation email containing information about accessing the recorded webinar.

Suggest a topic for a future session

Click here to see full webinar schedule

Brian Miller

Presenter: Brian Miller joined EPC in 2015, where he is the field applications engineer for eastern North America. He has over 30 years of experience in power electronics, as a design engineer and as a field application engineer. At IBM and Sony Ericsson he designed small, efficient power supplies and battery chargers for laptops, tablets, and other equipment, and designed a custom analog controller IC for laptop dc-dc and battery charging. Previous to EPC, Brian was a field application engineer for Semtech, where he was involved in designs for AC-DC, DC-DC, LED lighting, and other areas. He has authored patents, articles, and talks. Brian received his MSE and BS degrees from Duke University in Durham, N. Carolina.

Buy Now from

Thermal Management of GaN FETs

Register to view a replay of this webinar

By submitting this request, I agree with EPC Terms of Use and Privacy Policy.

* Denotes required field

Enter Captcha Value:*
captcha