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ePower Chipset Family for High Power Density Applications Chosen as Bodo’s Power System ‘Product of the Month’

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ePower Chipset Family for High Power Density Applications Chosen as Bodo’s Power System ‘Product of the Month’

EPC has introduced a 100 V, 65 A integrated circuit chipset designed for 48 V DC-DC conversion used in high-density computing applications and in 48 V BLDC motor drives for e-mobility, robotics, and drones. The EPC23101 eGaN IC plus EPC2302 eGaN FET offers an ePower Chipset capable of a maximum withstand voltage of 100 V, delivering up to 65 A load current, while capable of switching speeds greater than 1 MHz.

Bodo’s Power Systems
February, 2022
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