Gallium nitride–based high-electron–mobility transistors (HEMTs) have been widely adopted in both consumer and industrial power conversion due to their many material and device advantages over legacy silicon-based converters. The improvements in power-conversion efficiency at much higher switching frequencies that are enabled by GaN can translate to lower system costs and improved power density. Heat dissipation analysis and thermal modeling become critically important as power densities increase. In this article, we will review a thermal calculator tool released by Efficient Power Conversion (EPC). EPC manufactures enhancement-mode GaN HEMTs and integrated power-conversion circuits like half-bridges that form the building blocks of many converters.

Power Electronics News
November 2023
Read article

Lower-voltage GaN FETs are reducing size, minimizing cooling requirements and improving efficiency.

Lower-voltage GaN FETs (i.e., 100 V) are reducing size, minimizing cooling requirements and improving efficiency for many traditional Si-based power MOSFET applications. In this article, the challenges to repeatably and reliable characterization of the dynamic performance of these devices is discussed. Careful and thoughtful mechanical and electrical design of a customized GaN fixture and test board can overcome many of these challenges, enabling the confident use of these new WBG devices in your power-converter designs.

Power Electronics News
July, 2023
Read article

In this article, different power loop layouts are analyzed with simultaneous considerations for thermal management and electric parasitics.

The results show that an improved layout can provide a significant reduction in operating temperature rise while maintaining electrical performance benefits.

EE Power
October, 2022
Read Article

Efficient Power Conversion (EPC) provides a forum for engineers to receive product support, ask questions, and share ideas on using GaN technology.

EL SEGUNDO, Calif.—  June, 2022 — EPC announces the debut of a user community, the “GaN Talk Support Forum” as an environment for engineers to access product and design support and share ideas on the use of gallium nitride (GaN) based power technology. The forum was developed for engineers, engineering students, and all GaN enthusiasts and provides an opportunity for users to submit GaN-related questions and share ideas with the user community. Questions can be searched by topic category, top topics, or latest posts. Beyond submitting questions, users can share past questions and answers from within the forum via a ‘share’ link in the post.

Efficient Power Conversion (EPC) provides engineers with a growing array of design tools, models, and performance simulations for high performance GaN-based designs.

EL SEGUNDO, Calif.—  January, 2022 — EPC announces the debut of the GaN Power Bench™, a suite of design tools to assist engineers in getting the optimal performance from their GaN-based designs. eGaN^® FETs and ICs provide the fast switching, high efficiency and small size that can meet the stringent power density requirements of today’s leading-edge applications. The tools in the GaN Power Bench assist designers in the selection of the best GaN device for the application, simulate and optimize the thermal performance of the design, and provide application examples with all the supporting documentation needed to quickly and easily replicate the optimal design tips necessary for ideal performance.

This article discusses the challenges that thermal management raises due to increase power density, especially with chip-scale packaging (CSP). What is sometimes overlooked, however, is that CSP eGaN® power FETs and integrated circuits have excellent thermal performance when mounted on standard printed circuit board (PCBs) with simple methods for attaching heat sinks. Simulations, supported by experimental verification, examine the effect of various parameters and heat flow paths to provide guidance on designing for performance versus cost.

Bodo’s Power Systems
February, 2021
Read article

Gallium nitride (GaN) transistors have been in mass production for over 10 years. In their first few years of availability, the fast switching speed of the new devices – up to 10 times faster than the venerable Si MOSFET – was the main reason for designers to use GaN FETs. As the pricing of GaN devices normalized with the MOSFET, coupled with the expansion of a broad range of devices with different voltage ratings and power handling capabilities, much wider acceptance was realized in mainstream applications such as DC-DC converters for computers, motor drives for robots, and e-mobility bikes and scooters. The experience gained from the early adopters has led the way for later entrants into the GaN world get into production faster. This article is the first in a series of articles discussing three topics that can help power systems designers achieve the most out of their GaN-based designs at the lowest cost. The three topics are: (1) layout considerations; (2) thermal design for maximum power handling; and, (3) EMI reduction techniques for lowest cost.

Bodo’s Power Systems
January, 2021
Read article