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EPC to Showcase GaN-enabled Consumer Applications – eMobility, Drones, Robotics, and more at CES 2024

EPC to Showcase GaN-enabled Consumer Applications – eMobility, Drones, Robotics, and more at CES 2024

EPC gallium nitride (GaN) experts will be at Consumer Electronics Show (CES) to share how GaN enables enhanced features and performance in consumer electronics.

EL SEGUNDO, Calif – December 2023 – EPC, the global leader in enhancement-mode gallium nitride (eGaN®) FETs and ICs, will be showcasing the capabilities of GaN technology at CES 2024, demonstrating its role in enhancing features and performance in consumer electronics. This includes delivering higher efficiency, smaller size, and lower cost solutions.

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Highest Power Density for Regulated DC-DC Converters Achieved Using EPC GaN FETs and Analog Devices Controller

Highest Power Density for Regulated DC-DC Converters Achieved Using EPC GaN FETs and Analog Devices Controller

EPC and Analog Devices introduce a reference design using a new Analog controller fully optimized to drive EPC GaN FETs and achieving greater than 96.5% efficiency.

EL SEGUNDO, Calif.— July, 2022 — EPC announces the availability of the EPC9158, a dual output synchronous buck converter reference design board operating at 500 kHz switching frequency that converts an input voltage of 48 V - 54 V to a regulated 12 V output and delivers up to 25 A per phase or 50 A total continuous current. The combination of the new Analog LTC7890 synchronous GaN buck controller with ultra-efficient GaN FETs from EPC enables a highly efficient solution in a small footprint for high power density applications. The solution achieves 96.5% efficient at 48 V to 12 V and 50 A continuous current.

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The 48 V Revolution: Why GaN Plus Digital Control for Ultra-thin Laptops

The 48 V Revolution: Why GaN Plus Digital Control for Ultra-thin Laptops

This article discusses how GaN-based solutions coupled with digital control increase efficiency, shrink the size, and reduce system costs for high density computing applications like ultra-thin laptops and high-end gaming systems. As computers, displays, smartphones and other consumer electronics systems become thinner and more powerful over the past decade, there is increasing demand for addressing the challenge of thinner solutions while extracting more power out of limited space. To address this challenge, the comparative advantages of various non-isolated DC-DC step-down topologies for ultra-thin 48 V – 20 V power solutions that are designed to fit inside a notebook computer or an ultra-thin display are examined.

Power Electronics News
January, 2021
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