GaNの話シリコンを粉砕するために捧げたブログ
Term: 窒化ガリウム
15 post(s) found

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET

New 100 V eGaN Devices Increase Benchmark Performance Over the Aging Silicon Power MOSFET
9 22 2020

Efficient Power Conversion (EPC) is increasing the performance distance between the aging silicon power MOSFET and eGaN transistors with 100 V ratings.  The new fifth-generation “plus” devices have about 20% lower RDS(on) and increased DC ratings compared with the prior fifth-generation products.  This performance boost comes from the addition of a thick metal layer and a conversion from solder balls to solder bars.

効率95%で48 V入力、1 V / 10 A出力のVRMハイブリッド・コンバータ

効率95%で48 V入力、1 V / 10 A出力のVRMハイブリッド・コンバータ
10 07 2018
Gab-Su Seo1,2、Ratul Das1、and Hanh-Phuc Le1
1米コロラド大学のDepartment of Electrical, Computer, and Energy Engineering
2米国コロラドの国立再生可能エネルギー研究所のPower Systems Engineering Center

クラウド・コンピューティングやビッグデータ処理への需要が劇的に増加していることから、米国のデータセンターの電力消費量は、2020年までに730億kWhに達すると予測されています [1]。これは、米国全体の電力消費量の約10%を占めます。この消費の大部分は、非効率な電力供給アーキテクチャによる損失によって引き起こされ、改善のために大きな注意を払わなければなりません [2],[3]。

チップスケールのeGaN FETを使った製造可能で信頼性の高いプリント回路基板の設計

チップスケールのeGaN FETを使った製造可能で信頼性の高いプリント回路基板の設計
9 07 2017

Michael de RooijとAlana Nakataの共著、Efficient Power Conversion

以下で発表しました:PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of

ランド・グリッド・アレイ(LGA)、および/またはボール・グリッド・アレイ(BGA)の形態として、従来とは異なるチップスケール・パッケージ(CSP)に収めたeGaN FETは、さまざまなアプリケーションにわたって同等のMOSFETよりも電力密度と効率特性が高いというデモを繰り返し示されています [1,2]。これらの特性改善は、不要な寄生要素を最小限に抑える適切なレイアウト方法が広範にわたって文書化されています[1,3]。eGaN FETが市場に初めて投入されて以来7年間、フィールドで実際に使われた合計170億時間以上で、合計127個のデバイスの不具合がありました。そのうちの75個は、アセンブリ技術が不十分だったか、プリント回路基板の設計がうまくなかったことによるものでした [4]。設計者は、製造しやすさに影響するプリント回路基板の設計ルールにもっと精通しなければなりません。MOSFETに比べて、比較的サイズが小さいために許容度があまり大きくありません。この論文では、eGaN FETの性能を最大限に引き出すためのプリント回路基板設計のさまざまなガイドラインと、いまだに既存のプリント回路基板の製造能力に依存する信頼性について説明します。

Four Ways GaN Technology Helps Save the Planet

Four Ways GaN Technology Helps Save the Planet
4 11 2017

Gallium nitride (GaN) is a better semiconductor than silicon. There are many crystals that are better than silicon, but the problem has always been that they are far too expensive to be used in every application where silicon is used. But, GaN can be grown as an inexpensive thin layer on top of a standard silicon wafer enabling devices that are faster, smaller, more efficient, and less costly than their aging silicon counterparts.

How we devised a wirelessly powered television set

How we devised a wirelessly powered television set
3 09 2017

Televisions can get their content wirelessly, but there is one set of wires they still need: those in their power cord. The consumer electronics industry has floated ideas for freeing TVs from their power cords, but this goal remains elusive. There are several reasons, such as the difficultly of meeting high-power requirements for large-screen TVs and the need for identifying an economical technology. Nevertheless, eGaN FETs could play a role in making TVs truly cordless devices.

eGaN Technology Reliability and Physics of Failure – How eGaN FETs are expected to behave as the result of high gate voltage stress conditions

eGaN Technology Reliability and Physics of Failure – How eGaN FETs are expected to behave as the result of high gate voltage stress conditions
2 03 2017

The previous installment in this series focused on the physics of failure surrounding thermo-mechanical reliability of EPC eGaN® wafer level chip-scale packages. A fundamental understanding of the potential failure modes under voltage bias is also important. This installment will provide an overview of the physics of failure associated with voltage bias at the gate electrode of gallium nitride (GaN) field effect transistors (FETs). Here we look at the case of taking the gate control voltage to the specified limit and beyond to investigate how eGaN FETs behave over a projected lifetime.

eGaN Technology Reliability and Physics of Failure - Thermo-mechanical board level reliability of eGaN devices

eGaN Technology Reliability and Physics of Failure - Thermo-mechanical board level reliability of eGaN devices
1 13 2017

The first three installments in this series covered field reliability experience and stress test qualification of Efficient Power Conversion (EPC) Corporation’s enhancement-mode gallium nitride (eGaN®) field effect transistors (FETs) and integrated circuits (ICs).  Excellent field reliability that was documented is the result of applying stress tests covering the intended operating conditions the devices will experience within applications.  Of equal importance is understanding the underlying physics of how eGaN® devices will fail when stressed beyond intended operating conditions (e.g. datasheet parameters and safe operating area).  This installment will take a deeper dive into the physics of failure centered around thermo-mechanical reliability of eGaN® wafer level chip-scale packages (WLCSP).

See, Learn, and Discuss eGaN Technology at CES 2017

See, Learn, and Discuss eGaN Technology at CES 2017
12 04 2016

Every year in January 2017, the world’s consumer electronics community gathers in Las Vegas at the Consumer Electronics Show (CES) to see, learn and discuss the latest innovations and products available in the world of electronics.

More than 3,800 exhibitors spread out across 2.47 million net square feet of exhibit space, is the location where over 170,000 industry professionals, 50,000 outside of the U.S. wander, ogle, and “play with” the latest electronic devices.

2017年の私の予測

2017年の私の予測
11 11 2016

2016年1月、私は、そのとき、来る年のいくつかの予測をしました。無線充電、拡張現実、自動運転車、医療診断やインターネット・アクセスの進歩など、新しい市場に対する予測をしました。これらの市場における進歩は、すべての面で、予想よりも、時にはより速く、時にはより遅くなりました。そして、ここで、私たちは、まさに新しい年を迎えようとしており、おそらく、愚かなことに、私は、再び未来を予測しようと思います。

Forget Everything You Thought You Knew About Semiconductors

Forget Everything You Thought You Knew About Semiconductors
10 13 2016

In past postings , we looked at the applications that have emerged because of new capabilities available with #GaN technology. We also discussed the transformational nature of some of these applications in areas like medicine, telecommunications,human-machine interfaces, and the delivery of electrical power itself (wireless power transfer). GaN technology is entering an era similar to the 80’s and 90’s when the utility of technological improvement was apparent across broad commercial markets. Consequentially, consumers will be willing to pay a premium for the life-style improvements enabled by these improvements thereby accelerating growth of GaN applications for the foreseeable future.