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PCB Power Loop Layout for Chip-scale Package GaN FETs Optimizes Electrical and Thermal Performance

分類: Articles
PCB Power Loop Layout for Chip-scale Package GaN FETs Optimizes Electrical and Thermal Performance

In this article, different power loop layouts are analyzed with simultaneous considerations for thermal management and electric parasitics.

The results show that an improved layout can provide a significant reduction in operating temperature rise while maintaining electrical performance benefits.

EE Power
October, 2022
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