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小型化的低壓 GaN FET的準確表徵

小型化的低壓 GaN FET的準確表徵

低壓 GaN FET 可實現更小、冷却要求最小化和效率更高的解決方案

與採用傳統的矽基功率 MOSFET的應用相比,低壓 GaN FET(即 100 V)可實現更小,冷却要求最小化和效率更高的解決方案。 本文討論了氮化鎵元件如何應對動態性能需要重複和可靠的表徵的挑戰。 定制氮化鎵夾具和測試板的機械和電氣設計仔細、周全,就可以克服其中許多挑戰,使您能够在設計功率轉換器時,自信地使用這些新型寬能隙元件。

Power Electronics News
2023年7月
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EPC Opens GaN-based Motor Drive Design Application Center in Italy

EPC Opens GaN-based Motor Drive Design Application Center in Italy

The development of gallium nitride technology has ushered in a new age for power electronics. The greater bandgap, critical field, and electron mobility are the three factors that affect GaN technology the most. To concentrate on expanding motor drive applications based on GaN technology in the e-mobility, robotics, drone, and industrial automation areas, EPC has opened a new design application center close to Turin, Italy.

EE Times Europe
September, 2022
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EPC Opens New Motor Drive Center of Excellence

EPC Opens New Motor Drive Center of Excellence

New Motor Drive Center of Excellence (CoE) design center in Turin, Italy, to help customers exploit the power of GaN for growing motor drive applications

EL SEGUNDO, Calif.— September, 2022 —   EPC has opened a new design application center near Turin, Italy, to focus on growing motor drive applications based on GaN technology in the e-mobility, robotics, drones, and industrial automation markets.  The specialist team will support customers in accelerating their design cycles and define future Integrated Circuits for power management with state-of-the art equipment to test applications from 400 W to 10’s of kW.

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Thermal Management of Chip-Scale GaN Devices

Thermal Management of Chip-Scale GaN Devices

This article discusses the challenges that thermal management raises due to increase power density, especially with chip-scale packaging (CSP). What is sometimes overlooked, however, is that CSP eGaN® power FETs and integrated circuits have excellent thermal performance when mounted on standard printed circuit board (PCBs) with simple methods for attaching heat sinks. Simulations, supported by experimental verification, examine the effect of various parameters and heat flow paths to provide guidance on designing for performance versus cost.

Bodo’s Power Systems
February, 2021
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Layout Considerations for GaN Transistor Circuits

Layout Considerations for GaN Transistor Circuits

Gallium nitride (GaN) transistors have been in mass production for over 10 years. In their first few years of availability, the fast switching speed of the new devices – up to 10 times faster than the venerable Si MOSFET – was the main reason for designers to use GaN FETs. As the pricing of GaN devices normalized with the MOSFET, coupled with the expansion of a broad range of devices with different voltage ratings and power handling capabilities, much wider acceptance was realized in mainstream applications such as DC-DC converters for computers, motor drives for robots, and e-mobility bikes and scooters. The experience gained from the early adopters has led the way for later entrants into the GaN world get into production faster. This article is the first in a series of articles discussing three topics that can help power systems designers achieve the most out of their GaN-based designs at the lowest cost. The three topics are: (1) layout considerations; (2) thermal design for maximum power handling; and, (3) EMI reduction techniques for lowest cost.

Bodo’s Power Systems
January, 2021
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EPC公司進一步更新了其廣受歡迎的 氮化鎵(GaN)功率電晶體及積體電路的播客系列

EPC公司進一步更新了其廣受歡迎的 氮化鎵(GaN)功率電晶體及積體電路的播客系列

宜普電源轉換公司(EPC)依據《氮化鎵電晶體–高效功率轉換元件》第三版教科書的增訂內容,更新了首7個、合共14個教程的視頻播客,與工程師分享採用氮化鎵場效應電晶體及積體電路的理論、設計基礎及應用,例如雷射雷達(光達)、DC/DC轉換及無線電源等應用。

宜普電源轉換公司(EPC)更新了其廣受歡迎的“如何使用氮化鎵元件”的視頻播客系列。該視頻系列的內容是依據最新出版的《氮化鎵電晶體–高效功率轉換元件》.第三版教科書的內容製作。合共14個教程的視頻播客系列旨在為功率系統設計工程師提供基礎技術知識及針對專有應用的工具套件,從而讓工程師學習如何採用氮化鎵電晶體及積體電路,設計出更高效的功率轉換系統。

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EPC partners with Würth Elektronik eiSos to present Trilogy of Wireless Power Transfer

EPC partners with Würth Elektronik eiSos to present Trilogy of Wireless Power Transfer

The Trilogy of Wireless Power Transfer consists of three parts: Basics Principles of Wireless Power Transmission, Wireless Power Transfer Systems and Applications. The first part of the book explains the basic physical principles and the different methods of contactless power transmission. Furthermore, the leading standards are presented in this part. The second part describes wireless power transfer systems, the different topologies of wireless power transmission, the right selection of transmitter and receiver coils required to increase efficiency, and the selection of transistors, for instance. The third part is dedicated to practical applications. This includes applications within the scope of the Qi standard, as well as examples of proprietary solutions. An overview of EMI-relevant topics for closely and loosely coupled systems, as well as an example of a multimode wireless power transmission system round out the practical part. The authors of the "Trilogy of Wireless Power Transfer" are Cem Som, Division Manager Wireless Power Transfer at Würth Elektronik eiSos; and Dr. Michael de Rooij, Vice President Applications Engineering at Efficient Power Conversion Corporation, Inc. The book costs 19 euros and can be ordered from Würth Elektronik eiSos or through bookstores.

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How eGaN FETs power LIDAR

How eGaN FETs power LIDAR

LIDAR is presently a subject of great interest, primarily due to its widespread adoption in autonomous navigation systems for vehicles, robots, drones, and other mobile machines. eGaN devices are one of the main factors in making affordable, high performance LIDAR possible in a small form factor thus further fueling the LIDAR revolution.

EDN
By John Glaser
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eGaN FET-Based Synchronous Rectification

eGaN FET-Based Synchronous Rectification

As GaN-on-Si becomes more common in DC-DC converter designs, questions often arise from experienced designers about the impact of the unique characteristics of GaN transistors when used as synchronous rectifiers (SRs). In particular, the third quadrant off-state characteristics, better known as “body diode” conduction in Si MOSFETs, which is activated during converter dead-time, is of interest. For this article, the focus will be on the similarities and differences of Si MOSFETs and eGaN® FETs when operated as a “body diode” and outline their relative advantages and disadvantages.

Bodo’s Power Systems
By David Reusch & John Glaser
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Best Practices for Integrating eGaN FETs

Best Practices for Integrating eGaN FETs

Best design practices utilize the advantages offered by eGaN FETs, including printed circuit board (PCB) layout and thermal management. As GaN transistor switching charges continue to decrease, system parasitics must also be reduced to achieve maximum switching speeds and minimize parasitic ringing typical of power converters.

Power Electronics
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IEEE電力電子學會(PELS)線上研討會: “充分發揮採用晶片級封裝的氮化鎵電晶體及積體電路的優勢”

IEEE電力電子學會(PELS)線上研討會: “充分發揮採用晶片級封裝的氮化鎵電晶體及積體電路的優勢”

IEEE電力電子學會( PELS)將於2016年11月3日(星期四)舉行線上研討會,屆時將由Alex Lidow及Michael de Rooij主講並與參加者分享採用晶片級封裝的氮化鎵功率元件的設計及PCB製造方法。

氮化鎵技術領袖宜普電源轉換公司(EPC)的專家將於美國東部夏令時間(EDT)11月3日(星期四)早上11時至中午12時於IEEE電力電子學會( PELS)線上研討會中與工程師分享如何設計及使用氮化鎵電晶體。

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Thoughtful Board Design Unlocks the Promise of GaN

Thoughtful Board Design Unlocks the Promise of GaN

Power transistors with faster switching speeds will enable power supplies with smaller form factors and higher energy transfer efficiencies. Indeed, the elimination of heat sinks will give designers the ability to visualize entirely new form factors for power bricks and modules, including those enabling wireless power transfers. Gallium-nitride (GaN) transistors fabricated on silicon substrates can boost efficiencies and help shrink the footprint of power supplies.

Electronic Design
March, 2016
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Radiated EMI Filter Design for an eGaN FET Based ZVS Class D Amplifier in 6.78MHz Wireless Power Transfer

Radiated EMI Filter Design for an eGaN FET Based ZVS Class D Amplifier in 6.78MHz Wireless Power Transfer

In this installment, we present a method to design a suitable EMI filter that can reduce unwanted frequencies to levels within radiated EMI specifications, and do this without negatively impacting the performance of the wireless power coil. In addition, the overall radiated EMI design aspects will also be covered.

EEWeb - Wireless & RF Magazine
Michael de Rooij, Ph.D.
February, 1, 2016
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