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根據將氮化鎵和碳化矽材料的電子從價帶轉移到導帶所需的能量，氮化鎵和碳化矽元件被指定爲寬帶隙 (WBG) 半導體——碳化矽元件約爲 3.2 eV，氮化鎵元件則約爲 3.4 eV，而矽元件只有1.1 eV 。WBG 的擊穿電壓更高，在某些應用中可以達到 1,700 V。 在今年 5 月舉行的綫上PCIM Europe展會上，幾家公司展示了他們在 氮化鎵和碳化矽技術方面的最新創新，並且就 WBG 技術的發展方向分享了其獨特見解。
EE Times – Europe
2021 年 7 月
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Based on the authors' years of extensive experience, this is an authoritative overview of Wide Bandgap (WBG) device characterization.
EL SEGUNDO, Calif. – September 2018 – Efficient Power Conversion Corporation (www.epc-co.com) announces the publication by the Institution of Engineering and Technology of Characterization of Wide Bandgap Power Semiconductor Devices co-authored by EPC Senior Applications Engineer, Dr. Edward A. Jones. This textbook provides essential tools to assist researchers, advanced students, and practicing engineers in performing both static and dynamic characterization of WBG devices, particularly those based on using silicon carbide (SiC) and gallium nitride (GaN) power semiconductors. The book presents practical considerations for real applications and includes examples of applying the described methodology.
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Wide-bandgap materials, such as GaN and SiC, are enabling a new generation of power switching devices that switch faster and with fewer losses than the venerable silicon MOSFET, resulting in smaller, more efficient power supplies.
By Margery Conner
EDN
August 25, 2011
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