6月 08, 2016
Alex Lidow, Ph.D., CEO and Co-founder
In my 40 years’ experience in power semiconductors I have visited thousands of customers, big and small, on every continent except Antarctica. When the issue invariably turns to the packaging of the power semiconductor – transistor, diode, or integrated circuit – the requests for improvement fall into six categories:
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GaN FET 及集成电路
评估板
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How to Design an eGaN FET-Based Power Stage with an Optimal Layout (How2AppNote 007)