博客 -- 氮化镓技术如何击败硅技术

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13 post(s) found

1月 23, 2020

eGaN vs. 硅

John Glaser , Ph.D., Director of Applications

本文最初由Dr. John Glaser & Dr. David Reusch于2016年6月13日在Power Systems Design网站上发布。

11月 12, 2019

颠覆的时机已经到来 − 氮化镓正对硅功率MOSFETs发起正面攻击

Alex Lidow, Ph.D., CEO and Co-founder

硅已经存在很久了。是时候让一个更年轻且更适合的挑战者接管半导体材料的主导地位了。

5月 04, 2017

硅基氮化镓功率器件如何把硅基功率MOSFET逐出市场

Alex Lidow, Ph.D., CEO and Co-founder

Gallium nitride (GaN) power transistors designed for efficient power conversion have been in production for seven years. New markets, such as light detection and ranging, envelope tracking, and wireless charging, have emerged due to the superior switching speed of GaN. These markets have enabled GaN products to achieve significant volumes, low production costs, and an enviable reliability reputation. All of this provides adequate incentive for the more conservative design engineers in applications such as dc–dc converters, ac–dc converters, and automotive to start their evaluation process. So what are the remaining barriers to the conversion of the US$12 billion silicon power metal–oxide–semiconductor field-effect transistor (MOSFET) market? In a word: confidence. Design engineers, manufacturing engineers, purchasing managers, and senior management all need to be confident that GaN will provide benefits that more than offset the risk of adopting a new technology. Let’s look at three key risk factors: supply chain risk, cost risk, and reliability risk.

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