早在2015年，Venture Beat就發表了一篇關於氮化鎵晶片取代矽的文章。在那篇文章中，我斷言氮化鎵基功率半導體的廣泛普及是可能的，因為GaN FET將比矽具有更高的性能和更低的成本。 然而，人們仍然普遍誤解氮化鎵元件還沒有達到那個里程碑……這是一個錯誤的迷思。在這篇部落格文章中，我將試圖打破這個神話，並提醒大家，本次討論僅限於額定電壓低于400 V的元件的應用領域，因為這是EPC 的重點產品。

Guest GaN Talk Blog by: Pavel Gurev, Sinftech Rus LLC

This article originally appeared in Bodo’s Power Systems April 2021

In the past few years, gallium-nitride (GaN) FETs have become more widespread in power electronics. Due to their outstanding characteristics, GaN FETs play an increasingly important role in miniaturization of the switching converters with very high-power densities exceeding 100 W / cm³ and more. The efficiency of converters based on GaN transistors can reach 99.5%. Due to the extension of the conversion frequency towards the MHz range, the magnetic components (chokes, transformers) also decrease in size significantly. However, designers face numerous challenges in implementing practical GaN transistor designs. The best family members are presented in wafer-level chip-scale package; the drivers are also quite miniature.

Efficient Power Conversion (EPC) is increasing the performance distance between the aging silicon power MOSFET and eGaN transistors with 100 V ratings.  The new fifth-generation “plus” devices have about 20% lower R_DS(on) and increased DC ratings compared with the prior fifth-generation products.  This performance boost comes from the addition of a thick metal layer and a conversion from solder balls to solder bars.