GaN技术杂谈

随着新年的到来，花几分钟时间回顾2018年的成功并展望2019年的期望是值得的。 

世界改变性创新，例如1970年发布的首台录像机（VCR）到全球首台可无线充电的笔记本电脑，都是在CES这个全球创新聚集地宣布的。

eGaN® FETs和ICs由于其紧凑的尺寸、超高速开关和低导通电阻，使得非常高密度的电源转换器设计成为可能。大多数高密度转换器输出功率的限制因素是结温，这需要更有效的热设计。eGaN的芯片级封装还提供了六面散热，能够从芯片的底部、顶部和侧面有效地散热。本应用说明介绍了一种高性能的热解决方案，以提高基于eGaN转换器的输出电流能力。

这篇文章最初由Bill Kleyman于2018年11月5日发布在 Data Center Frontier 网站上。了解更多关于 eGaN技术 和EPC GaN解决方案在 数据中心中的应用。

这篇文章由Planet Analog总编辑Steve Taranovich撰写，最初于2018年8月10日发表在Planet Analog网站上。了解更多关于eGaN技术和EPC GaN解决方案在LiDAR中的应用。

本文最初于 2018 年 5 月 16 日星期三发布在化合物半导体网站上。了解更多有关 eGaN 技术和 EPC 氮化镓解决方案在汽车应用中的应用。

本文最初发布于2018年5月在Bodo's Power Systems网站。了解更多关于eGaN技术和EPC GaN解决方案的汽车应用。

Come see the world’s smallest, most efficient, and lowest cost DC-DC converters!  eGaN technology makes this, and much more possible and will be on full display at this year’s American Power Engineering Conference, APEC, where power engineers from around the world gather to see and learn about the latest innovations and products available in the world of power electronics.

EPC GaN experts will be presenting a half-day educational seminar on the state of GaN technology and its application to leading-edge power electronics. In addition, EPC will deliver six technical sessions, as well as demonstrate eGaN applications in our booth and customer suite.

Did you see that car? The one with what looks like antlers on the top? Most people would be hard-pressed to miss a self-driving car navigating about public roads. Most autonomous vehicles, or self-driving cars as they are also known, are outfitted with a myriad of sensors, cameras, and even lasers that serve a critical function – providing information about the vehicle’s surroundings. These sensors and cameras are one means of identifying pedestrians, bicycle riders, lane lines, street signs, lights, traffic cones, and other visual details that are important for safe driving.

Written by Michael de Rooij and Alana Nakata - Efficient Power Conversion

Published in: PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of

eGaN FETs, which are available in non-traditional chip scale packages (CSP) as land grid array (LGA) and/or ball grid array (BGA) formats, have repeatedly demonstrated higher power density and higher efficiency performance than equivalent MOSFETs across various applications ^{[1, 2]}. Those improvements are contingent upon proper layout practices documented extensively in ^{[1, 3]} that minimize unwanted parasitic elements. Over the seven years since eGaN FETs were first launched into the market there have been a total of 127 device failures out of a total of more than 17 billion hours in actual use in the field, 75 of which were a result of poor assembly technique or poor printed circuit board (PCB) design practices ^[4]. Designers are becoming more familiar with the PCB design rules that affect manufacturability and are less forgiving compared to MOSFETs due to their relatively smaller sizes. This paper will cover the various guidelines for PCB design that maximize the performance of eGaN FETs and reliability yet still rely on existing PCB manufacturing capabilities.