部落格:氮化鎵技術如何擊敗矽技術

雜談GaN技術

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Term: MOSFET
13 post(s) found

一月 23, 2020

eGaN vs. 矽晶

John Glaser , Ph.D., Director of Applications

這篇文章最初由 John Glaser 博士和 David Reusch 博士於 2016 年 6 月 13 日在 Power Systems Design 網站上發表。

十一月 12, 2019

現在是顛覆的時刻 − 氮化鎵正全面攻擊矽基功率MOSFETs

Alex Lidow, Ph.D., CEO and Co-founder

矽已經存在夠久了。是時候讓一個更年輕且更具競爭力的挑戰者來接管半導體材料的主導地位了。

五月 04, 2017

矽基氮化鎵功率元件如何把矽基功率MOSFET逐出市場

Alex Lidow, Ph.D., CEO and Co-founder

Gallium nitride (GaN) power transistors designed for efficient power conversion have been in production for seven years. New markets, such as light detection and ranging, envelope tracking, and wireless charging, have emerged due to the superior switching speed of GaN. These markets have enabled GaN products to achieve significant volumes, low production costs, and an enviable reliability reputation. All of this provides adequate incentive for the more conservative design engineers in applications such as dc–dc converters, ac–dc converters, and automotive to start their evaluation process. So what are the remaining barriers to the conversion of the US$12 billion silicon power metal–oxide–semiconductor field-effect transistor (MOSFET) market? In a word: confidence. Design engineers, manufacturing engineers, purchasing managers, and senior management all need to be confident that GaN will provide benefits that more than offset the risk of adopting a new technology. Let’s look at three key risk factors: supply chain risk, cost risk, and reliability risk.

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