宜普電源轉換公司（EPC）首席執行長Alex Lidow與Light Reading分享他有可能兩年之內的突破是顛倒整個半導體市場 -- 在氮化鎵中實現CMOS邏輯

Light Reading
作者：Brian Santo
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DC-DC “brick” converters are familiar to many engineers, and have wide usage in telecommunications, networking, data centers, and many other applications. This is due in large part to adoption of a common footprint defined by the Distributed-power Open Standards Alliance (DOSA) and generally accepted input/output voltage ranges. These converters provide isolation and voltage step-down, and have become increasingly sophisticated, with features that enable advanced system optimization and control.

EDN Network
November 23, 2015
By: John Glaser
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“The semiconductor industry will become one where there are a lot of large corporations and smaller companies will, in effect, be outsourced R&D, much like the pharmaceutical sector,” says Alex Lidow, CEO of Efficient Power Conversion. He says in this scenario Qorvo Corporation and Intersil Corp. could become attractive targets.

Lidow, however, believes consolidation may bring a dark ages to innovation in the semiconductor industry.

Forbes
November 23, 2015
By: Antoine Gara
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The future is clear, but, when that future is going to happen and who is going to benefit? That's not clear. I think the adoption rate is anybody's guess.

Investors Business Daily
November 17, 2015
By: Allison Gatlin
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矽谷有賴矽材料而得以蓬勃發展。但該材料的性能已經達到最高極限。有些人預見，未來將是氮化鎵材料的世界。什麼是氮化鎵？這意味著什麼？

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Semiconductor firms have announced $100.6 billion in mergers and acquisitions this year. Chip makers have long used acquisitions to obtain new technology. But many recent deals resemble consolidation waves in older industries, motivated mainly by trimming costs in areas like manufacturing, sales and engineering.

Wall Street Journal
October 18, 2015
By: Don Clark
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根據Transparency Market Research公司的全新調查報告指出，全球氮化鎵半導體元件市場在2012年的營銷額爲三億七千九百八十二萬美元，並估計在2019年底該市場的營銷達二十二億零三百七十三萬美元。根據2013年至2019的市場預測，該氮化鎵半導體元件市場的年均複合增長率將達24.6%。

雜誌：Industry Today
2015年10月14日
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The combination of lower on-resistance, faster switching speeds, lower thermal impedance, and smaller physical size of eGaN FETs continues to raise the bar for power transistor performance. As GaN technology matures, not only does the performance of these transistors rapidly improve, but significant reductions in cost are also realized. Not only will GaN devices continue to enable new applications, they will replace silicon power transistors in cost-sensitive applications as well. As a matter of fact, the first signs of this happening are already here.

Power Systems Design
By: Johan Strydom, Ph.D.
September 26, 2015
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In recent years, the acceleration predicted by Moore’s law has slipped. However, silicon could give way to new materials for making faster and smaller transistors.

New York Times
By: John Markoff
September 26, 2015
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電子工程界後裔Alex Lidow認爲技術業界的必用材料需要改變。六十歲的Lidow現爲宜普電源轉換公司的首席執行長，是技術業界大力鼓吹利用氮化鎵材料製造電晶體及半導體的提倡者。技術業界一直以來都依靠採用傳統的矽材料製造電晶體及半導體。這是一門非常獲利的生意，根據代表於美國設立的公司的SIA估計，去年全球半導體業界的營收達三千三百五十八億美元。

Fast Company
2015年9月
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The company Alex founded in 2007, called Efficient Power Conversion, or EPC, is wholly dedicated to the task of putting GaN in the forefront for use in a variety of things. Wireless power transmission, Class D audio amplifiers, (using a small circuit board, this would produce less heat, and extend battery life on portable systems); and pulsed lasers, or LiDAR (Light Distancing and Ranging), designed to quickly create 3D images useful in mapping and meteorology.

By: Bruce Rogers
Forbes
September 3, 2015
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電力的成本反映了社會經濟是否發展良好。這是因爲具備成本效益的電力可提高生活質素、推動全新應用的出現及業界的健康發展。氮化鎵元件的出現可替代備受尊敬但日益陳舊的矽技術及解决方案，使得我們可滿足社會對更高效電源的要求並帶領業界的發展。

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採用無綫電源充電的產品不斷增多及各種移動應用採用多種不同的無綫電源標準使消費者容易混淆，而且阻礙無綫電源應用的普及。本章討論可支持多種模式並工作在各種高（6.78 MHz）低（100 kHz - 315 kHz)頻率的放大器拓撲。

EEWeb - Wireless & RF 雜誌
2015年8月
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The trend for electronics is to continually push towards miniaturization while increasing performance. With silicon MOSFET technology fast approaching its theoretical limit, enhancement mode gallium nitride (eGaN^®) FETs from EPC have emerged to offer a step change improvement in power FET switching performance, enabling next generation power density possibilities by decreasing size and boosting efficiency. This article will explore the recommended layout techniques required to fully extract the benefits of EPC’s eGaN FETs.

By: Ivan Chan & David Reusch, Ph.D.
EEWeb –Modern Printed Circuits
August, 2015
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Wireless charging may have a standards battle to contend with, but there’s also a major a measurement problem. The quest for convenient living and energy conservation poses a ‘Ying/Yang’ dilemma living in the age of electronics. This is certainly the case with wireless power transfer technology. This rapidly emerging technology has the promise of “cutting the cord” and displacing the need for AC/DC wall adapters and perhaps eventually wall sockets. The question now is; will wireless power increase our carbon footprint by being less efficient than the traditional plug-in AC/DC wall adapters?” Are some wireless systems more efficient than others? These are two fundamental questions that need to be examined in an energy conscious world governed by energy efficient standards.

EETimes
August 4, 2015
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一種全新產品的面世有可能使檢查大腸中的癌細胞好像吞下藥丸般這麽容易。這種技術是基於一種由宜普電源轉換公司（EPC）開發的全新晶片，該晶片並沒有使用矽技術 -- 它使用了氮化鎵（GaN）技術。宜普公司的首席執行長Alex Lidow對Quartz談及他們公司的晶片可以耐受Check Cap內的各個感應器所需的高電壓。

Quartz
2015年7月30日
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由於PAPR比率在5G技術中會變差，氮化鎵(eGaN)技術被認爲是支持5G技術的基站結構在功效方面的最重要解決方案，而氮化鎵功率電晶體已經實現了波峰跟蹤應用，我們並預期在未來的3至5年之間，當氮化鎵技術繼續發展，市場將會有更多的新興應用陸續出現。

EDN
Steve Taranovich
2015年7月17日
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EPC garners the attention of MIT Technology Review with its new products targeted for wireless charging applications. Recognizing EPC as a catalyst for jump-starting the market for wireless power systems, the author highlights the need for universally accepted technology standards. He reinforces his position quoting Alex Lidow saying that “…convenience, cost, and efficiency” are all factors needed for broad adoption of any standard…

MIT Technology Review
July 15, 2015
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全新EPC2107及EPC2108 eGaN^®功率積體電路包含單片半橋式元件及集成式自舉功能，專爲符合無綫充電聯盟（A4WP）第二及第三級規範的解決方案而設。此外，爲了讓客戶容易對氮化鎵元件進行評估，我們也提供開發板及包含發射器及接收器的無綫電源傳送解决方案。

宜普電源轉換公司（EPC）宣佈推出內含整合式自舉功能的場效應電晶體的eGaN半橋功率積體電路 EPC2107（100 V）及EPC2108EPC2108 （60 V）。該積體電路去除了由閘極驅動器所引致的反向恢復損耗，也不需高側箝位。這是首次在eGaN功率電路中整合了一個自舉場效應電晶體。

Consumers want to be able to go wirelessly where they want, when they want. They want televisions to be seamlessly synchronized with tablets, phones, laptops, and automobiles. They want all their communication, information, and entertainment to be available immediately, with high resolution, all the time. Recently the automobile industry has caught on to this trend and has begun to show its vision of the future for the fully mobile lifestyle.

Consumers also do not want to worry about running out of battery life – no more looking for an open outlet at the airport. This untethered life is the Mobility Imperative and it is driving innovation in consumer products, which in turn, is pushing the limits of silicon-based semiconductor technology.

Nikkei Business Publications
July 10, 2015
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