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GaN vs. Silicon Smackdown

GaN vs. Silicon Smackdown

One way to tell when a new technology has passed the tipping point of adoption is by the voices advocating the status quo. The more conservative voices tend to cite older information that, given the fast change of trajectory that occurs at a tipping point, can lead to poor decisions for new designs. In the world of GaN power devices the tipping point occurred in the past two years when the rate of new GaN-based designs started to double year-on-year, and the legacy MOSFET designs started to face critical supply shortages due to their finely tuned, but less flexible supply chains. GaN devices, on the other hand, have remained in stock at most major distributors due to their relatively new and flexible supply chains utilizing older silicon foundries, but affording these foundries a new and vibrant future. In this article we will address some of the common misconceptions still showing up in articles and at conferences, usually presented by advocates of the status quo.

Bodo’s Power Systems
May, 2022
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寬能隙元件建構高效節能綠世界

寬能隙元件建構高效節能綠世界

以碳化矽(SiC)、氮化鎵(GaN)材料為主流的寬能隙(WBG)半導體功率元件,在節能永續意識抬頭的今日成為各種電源系統應用的寵兒;2022年Tech Taipei系列研討會首度以WBG元件為題,邀請業界重量級業者,從設計、製造、測試等不同面向與現場超過400位聽眾分享最新技術與應用趨勢...

EE Times Taiwan
2022年3月
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功率系統採用GaN的5大誤區

功率系統採用GaN的5大誤區

我們將在本文討論客戶爲何遲遲未採用氮化鎵技術的一些最常見原因,氮化鎵技術顯然是較舊的矽基功率MOSFET的替代技術。在不深入詳細研究統計數據的情况下,按最常發生推導出一系列原因,並理解某些應用比其他應用更側重氮化鎵技術的某些特性。我們的討論僅限於額定電壓低於400 V的元件,因爲這是EPC公司的氮化鎵場效應電晶體和積體電路的重點應用。

PSD功率系統設計
2022 年3月
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GaN Application Base Widens, Adoption Grows

GaN Application Base Widens, Adoption Grows

Mature, low-cost manufacturing and proven reliability spur use in EVs, smartphones, and consumer electronics.

Efficient Power Conversion (EPC) has logged more than 100 emerging applications for its eGaN FETs and ICs. Alex Lidow, the company’s CEO, said the five fastest-growing applications are lidar systems for robotics, drones, consumer products, driver alertness systems, and autonomous vehicles; DC-DC converters for AI systems, servers, and telecom power systems; motor drives for e-mobility and robotics; satellite systems, including motor drives and DC-DC power supplies that require radiation hardness; and solar power point trackers.

Semiconductor Engineering
December, 2021
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GaN Devices for Smaller, Lighter, Smoother Motor Drives

GaN Devices for Smaller, Lighter, Smoother Motor Drives

Today, the permanent magnet motor, also known as DC brushless motor (BLDC), is widely used and offers higher torque capability per cubic inch and higher dynamics when compared to other motors. So far, silicon-based power devices have been dominant in the inverter electronics, but today their performance is nearing their theoretical limits. There is an increasing need for higher power density. Gallium nitride (GaN) transistors and ICs have the best attributes to satisfy these needs.

Power Systems Design
November, 2021
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應對用於超薄計算應用的超薄、具高功率密度的 48 V DC/DC 轉換器的電源和磁性設計挑戰

應對用於超薄計算應用的超薄、具高功率密度的 48 V DC/DC 轉換器的電源和磁性設計挑戰

在過去十年中,計算機、顯示器、智能手機和其他消費電子系統變得更薄,同時功能也變得更强大。因此,市場對具有更高功率密度的更薄電源解决方案的需求不斷增加。本文研究了額定功率爲 250 W、超薄的48 V / 20 V轉換器,它可以採用各種非隔離型 DC/DC 降壓拓撲的可行性。我們研究了各種非隔離型拓撲的優缺點,從而瞭解拓撲如何影響功率電晶體和磁性元件的選擇,特別是電感器,因爲這兩個元件產生轉換器的大部分損耗。本文還詳細分析了爲這些應用設計薄型電感器所面對的挑戰,包括電感器損耗的因素、電感器尺寸和設計權衡,包括對EMI的影響。我們是以選擇、構建和測試了超薄多電平轉換器拓撲。從該轉換器獲得的實驗結果,用於進一步優化操作設置和元件的選擇,從而實現超過98%的峰值效率。

EPC公司Michael de Rooij
Würth Elektronik 公司Quentin Laidebeur

IEEE Power Electronics Magazine
2021年9月
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Bodo 寬能隙專家演講 – 氮化鎵半導體專題 - 2021 年 6 月

Bodo 寬能隙專家演講 – 氮化鎵半導體專題 - 2021 年 6 月

由 Bodo Power Systems 主辦的氮化鎵行業專家圓桌會議的嘉賓包括:

  1. EPC公司的首席執行長兼共同創始人Alex Lidow
  2. Power Integrations公司的市場行銷與應用工程副總裁Doug Bailey
  3. Nexperia 公司的氮化鎵功率技術行銷戰略總監Dilder Chowdhury
  4. Navitas Semiconductor公司的市場行銷戰略高級總監Tom Ribarich
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GaN in Space Applications

GaN in Space Applications

Gallium nitride power device technology enables a new generation of power converters in space operating at higher frequencies, higher efficiencies, and greater power densities than everachievable before. GaN power devices can also exhibit superior radiation tolerance compared with Silicon MOSFETs depending upon their device design.

Power Electronics Europe
December, 2020
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氮化鎵的崛起:矽基氮化鎵積體電路重新定義功率轉換

氮化鎵的崛起:矽基氮化鎵積體電路重新定義功率轉換

離散式功率電晶體,無論它是矽基還是矽基氮化鎵,都進入了最後發展階段。 矽基氮化鎵積體電路可以在較小的佔板面積內實現更高的性能,並且顯著降低成本和減少所需的元件工程。 本文詳細闡析氮化鎵元件的崛起和矽基氮化鎵積體電路如何重新定義功率轉換。

Bodo’s Power Systems
2020年10月
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氮化鎵元件緩解了矽元件的問題

氮化鎵元件緩解了矽元件的問題

就像生活要面對現實一樣,老年人離開舞臺而讓位給年輕人,矽元件也是需要向現實低頭。 隨著氮化鎵元件的問世和普及,正逐步淘汰舊有可靠的矽元件。 在過去的四十年中,隨著功率MOSFET元件的結構、技術和電路拓撲的創新與不斷增長的電力需求同步發展,電源管理的效率和成本一直以來得以穩步改善。 但是,在業界發展的新時代,隨著矽功率MOSFET元件接近其理論極限,其演進速度下降了很多。 同時,新材料氮化鎵的理論性能極限穩步發展,其性能極限比老化的MOSFET元件高出6,000倍,並且比目前市場上最好的氮化鎵產品高出300倍。

EEWeb
2020年7 月16日
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Gallium Nitride Integration: Breaking Down Technical Barriers Quickly

Gallium Nitride Integration: Breaking Down Technical Barriers Quickly

An integrated circuit made using GaN-on-Si substrates has been in production for over five years. The ultimate goal is to achieve a single component IC that merely requires a simple digital input from a microcontroller and produces a power output that drives a load efficiently, reliably under all conditions, in the smallest space possible, and economically. Discrete power transistors, whether silicon-based or GaN-on-Si, are entering their final chapter. Integrated GaN-on-Si can offer higher performance in a smaller footprint with significantly reduced engineering required.

IEEE Power Electronics Magazine
March 2020
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面向多種功率應用的氮化鎵電晶體

面向多種功率應用的氮化鎵電晶體

矽功率MOSFE追不上目前功率電子業界的演進步伐 -- 業界需要具備高效、高功率密度及細小的外型尺寸的元件。業界看到矽MOSFET已經達到它的理論極限,從而需要找出全新元件。氮化鎵(GaN)是一種HEMT元件,具備附加增值的優勢,被證明為可以支持全新應用的要求。

Power Electronics News
2020年3月25日
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GaN in Space

GaN in Space

This article discussed an oft forgotten or little-noticed part of the spacecraft enabling travel into outer space---power management in the space vehicle. Wide bandgap semiconductors like gallium nitride (GaN), silicon carbide (SiC), as well as diamond, are looking to be the most promising materials for future electronic components since the discovery of silicon. These technologies, depending upon their design, offer huge advantages in terms of power capability (DC and microwave), radiation insensitivity, high temperature and high frequency operation, optical properties and even low noise capability. Therefore, wide bandgap components are strategically important for the development of next generation space-borne systems. eGaN devices are quickly gaining momentum in the space industry and we will see many more applications for them by NASA and commercial contractors in future programs like Artemis and other programs in countries around the globe pursuing efforts into Space.

Power Systems Design
November, 2019
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氮化鎵正面攻擊矽功率MOSFET元件

氮化鎵正面攻擊矽功率MOSFET元件

目前的氮化鎵場效應電晶體在尺寸及性能方面以飛快的速度發展,而目前為業界樹立基準的氮化鎵元件的性能還可以提升多300倍。

最早採用氮化鎵元件的應用是利用氮化鎵的超快速開關速度,例如面向全自動駕駛車輛和無人機的雷射雷達系統、機械人,以及4G/LTE基站。氮化鎵元件的產量一直在增加,而其價格跟開關速度更慢、尺寸更大型和日益陳舊的MOSFET元件相約。因此,目前正是氮化鎵元件正面攻擊MOSET的時候!。

Bodo’s Power Systems
2019年6月
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PSDtv - EPC on Why Silicon is Dead at APEC 2019

PSDtv - EPC on Why Silicon is Dead at APEC 2019

In this episode of PSDtv Alex Lidow, Chief Executive Officer and Co-Founder of Efficient Power Conversion (EPC) is at APEC 2019 in Anaheim and discusses why their GaN on Silicon devices make Silicon now dead.

PSDtv
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Gallium nitride is the silicon of the future

Gallium nitride is the silicon of the future

Last week, Anker debuted a tiny new power brick, crediting its small size with the component it uses instead of silicon: gallium nitride (GaN). It’s the latest example of the growing popularity of this transparent, glass-like material that could one day unseat silicon and cut energy use worldwide.

The Verge
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