EPC技术文章

How to Integrate GaN Power Stages for Efficient Battery-Powered BLDC Motor Propulsion Systems

This article discusses the advantages of GaN-based power stages and introduces a sample device from EPC, implemented in a half-bridge topology. It explains how to use associated development kits to quickly get started on a project. In the process, designers will learn how to measure the parameters of a BLDC motor and operate it in sensorless field orientation control (FOC) with minimal programming effort using Microchip Technology’s motorBench Development Suite.

Digi-Key Electronics
April, 2023
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企业采访 - 宜普电源转换公司

Easy Engineering媒体采访了宜普电源转换公司(EPC)的市场营销总监Renee Yawger,了解目前氮化镓器件应用的情况和氮化镓技术的未来。

Easy Engineering
2022年5月
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Utilizing GaN Inverters for Battery-Powered Motor Drive Applications

GaN transistors and ICs increase power density in motor drive applications. An optimal lay-out approach allows obtaining ring-free output switching waveforms and clean current reconstruction signals either from leg shunts or from in-phase shunts.

EEPower
October, 2021
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用于以电池供电的电机驱动应用且基于氮化镓器件的 1.5kW 逆变器

氮化镓晶体管和集成电路 提高了电机驱动应用的功率密度。最佳布局允许从桥臂分流器或同相分流器获得没有振铃噪声的输出开关波形和“干净“的电流重建信号。

Bodo’s Power Systems
2021 年 6 月
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Product roundup: GaN power semiconductors gain traction

(Image: Yole)

Manufacturers of GaN power semiconductors showcased their latest products, from 100 V to 650-V devices at PCIM Europe. PCIM Europe showcased several presentations about the benefits and use cases of wide bandgap (WGG) semiconductors, including gallium nitride (GaN) and silicon carbide (SiC). Several manufacturers, including EPC, GaN Systems, Infineon, Nexperia, and STMicroelectronics announced several new families of GaN power semiconductors during the week.

Electronic Products
May, 2021
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面向电池供电的电机驱动应用并基于氮化镓ePower功率级集成电路的逆变器

氮化镓晶体管和集成电路通过消除输入滤波器中的电解电容,以提高电机驱动应用的功率密度。氮化镓器件的卓越开关性能可消除死区时间且实现无与伦比的正弦电压和电流波形,从而实现更平滑且没有噪声的操作。

Bodo’s Power Systems
2021年4月
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氮化镓(GaN)集成电路重新定义功率转换

氮化镓技术发展迅速,在开发出多代全新分立器件后,具备更高效、更小尺寸和成本更低等优势的新世代集成电路继续崛起。氮化镓集成电路让产品可以更小型化、开关更快、更高效且更易于设计。

Power Systems Design
2021年3月 (第36-39页)
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How GaN Integrated Circuits Are Redefining Power Conversion

Gallium nitride (GaN) power devices have been in production for over 10 years and, beyond just performance and cost improvements, the most significant opportunity for GaN technology to impact the power conversion market comes from the intrinsic ability to integrate multiple devices on the same substrate. This capability will allow monolithic power systems to be designed on a single chip in a more straightforward, higher efficiency, and more cost-effective way.

Power Electronic News
March, 2021
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Laser Driver IC Could Spur Burst Of Activity In Lidar Applications

New family of laser driver IC products will enable faster adoption and increased ubiquity of ToF solutions across a wider array of end-user applications.

How2Power
March, 2021
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Gallium Nitride Integration: Breaking Down Technical Barriers Quickly

An integrated circuit made using GaN-on-Si substrates has been in production for over five years. The ultimate goal is to achieve a single component IC that merely requires a simple digital input from a microcontroller and produces a power output that drives a load efficiently, reliably under all conditions, in the smallest space possible, and economically. Discrete power transistors, whether silicon-based or GaN-on-Si, are entering their final chapter. Integrated GaN-on-Si can offer higher performance in a smaller footprint with significantly reduced engineering required.

IEEE Power Electronics Magazine
March 2020
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APEC 2019视频

宜普电源转换公司的基于氮化镓的器件乃前沿技术。在本视频,宜普公司的首席执行官Alex Lidow于APEC展会现场与 Alix Paultre分享多个design in项目,从而展示基于氮化镓的器件的各种优势。

硅已经死亡

宜普电源转换公司首席执行官兼共同创办人Alex Lidow于APEC 2019展览会的Ridley Engineering展览摊位进行演讲,题目是“硅已经死亡”。

The Growing Ecosystem for eGaN FET Power Conversion

In recent years, GaN-based power conversion has increased in popularity due to the inherent benefits of eGaN FETs over conventional Si transistors. Migrating a converter design from Si to GaN offers many system-level improvements, which require consideration of all the components in that system. This trend has subsequently spurred a growth in the ecosystem of power electronics that support GaN-based designs.

Power Systems Designs
By Edward A. Jones, Michael de Rooij, and David Reusch
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Why experts believe cheaper, better lidar is right around the corner

This article takes a deep dive into lidar technology. It explains how the technology works and the challenges technologists face as they try to build lidar sensors that meet the demanding requirements for commercial self-driving cars.

The bottom line is that while bringing lidar costs down will take a significant amount of difficult engineering work, there don't seem to be any fundamental barriers to bringing the cost of high-quality lidar down below $1,000—and eventually below $100. That means the technology—and ultimately, self-driving vehicles that depend on lidar—should be well within reach for ordinary consumers.

Ars Techinca
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eGaN技术的可靠性及器件失效的物理原因 - 栅极电压应力测试

本系列的第四章中,我们探讨了采用晶圆级芯片规模封装的eGaN器件的热机械可靠性。同样重要的是,我们需要了解有栅极偏置时,器件有可能发生的故障模式。本章探讨氮化镓(GaN)场效应晶体管的栅极在偏置电压时失效的物理原因。我们把eGaN FET的栅极控制电压提升至特定的最大极限值和极限值以上,从而分析该器件在失效前的性能。

Planet Analog
Chris Jakubiec
2016年11月29日
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博客(4):eGaN技术的可靠性及器件失效的物理原因

在本系列的第一、二及第三章中,我们详细讲解了关于EPC增强型氮化镓场效应晶体管(eGaN FET)及集成电路(IC)的现场可靠性及它们被认证通过应力测试。在应用中,我们把器件置于预期的工作条件下并施加应力,其测试结果引证了氮化镓器件的现场可靠性。同样重要的是了解 eGaN器件固有的物理特性,它如何在被施加应力后并超出预期工作条件时(例如数据表的参数及安全工作区(SOA))而失效。本章将进一步深入探讨失效的物理原因 -- 采用晶圆级芯片规模封装(WLCSP)的eGaN器件的热机械可靠性。

Planet Analog
Chris Jakubiec
2016年9月7日
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博客(3):eGaN技术的可靠性及器件失效的物理原因

在本系列的第一及第二章,我们详细讲解了关于EPC的增强型氮化镓场效应晶体管(eGaN®FET)及集成电路(IC)的现场可靠性报告。具备优越的现场可靠性的eGaN器件展示出通过基于应力的认证测试可确保客户的应用也可以非常可靠。本章将阐释EPC器件在认证之前被置于及通过的各种应力测试。

Planet Analog
Chris Jakubiec
2016年7月9日
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eGaN技术的可靠性及元件失效的物理原因–确证eGaN FET的现场可靠性

宜普电源转换公司(EPC)的增强型氮化镓场效应晶体管(eGaN® FET)及集成电路正在驱动最终用户应用的发展,包括LiDAR、无线充电、DC/DC电源转换、射频发射基站、卫星系统及音频放大器等应用。

从现场可靠性数据可以确证eGaN® FET及集成电路于客户应用的品质。在本章节,我们分享eGaN FET的可靠性及现场数据的概述,包括在过去六年间我们对量产及已经付运的eGaN产品所收集的可靠性现场数据,以及分析超过170亿小时受测器件的现场数据。最后所得的FIT比率(109小时内发生失效的器件)大约是0.24,这是目前最好的现场可靠性测试结果。

Plant Analog
作者:Chris Jakubiec
2016年5月1 日
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