宜普电源转换公司（EPC）首席执行官Alex Lidow与Light Reading分享他有可能两年之内的突破是颠倒整个半导体市场 -- 在氮化镓中实现CMOS逻辑

Light Reading
作者：Brian Santo
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DC-DC “brick” converters are familiar to many engineers, and have wide usage in telecommunications, networking, data centers, and many other applications. This is due in large part to adoption of a common footprint defined by the Distributed-power Open Standards Alliance (DOSA) and generally accepted input/output voltage ranges. These converters provide isolation and voltage step-down, and have become increasingly sophisticated, with features that enable advanced system optimization and control.

EDN Network
November 23, 2015
By: John Glaser
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“The semiconductor industry will become one where there are a lot of large corporations and smaller companies will, in effect, be outsourced R&D, much like the pharmaceutical sector,” says Alex Lidow, CEO of Efficient Power Conversion. He says in this scenario Qorvo Corporation and Intersil Corp. could become attractive targets.

Lidow, however, believes consolidation may bring a dark ages to innovation in the semiconductor industry.

Forbes
November 23, 2015
By: Antoine Gara
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The future is clear, but, when that future is going to happen and who is going to benefit? That's not clear. I think the adoption rate is anybody's guess.

Investors Business Daily
November 17, 2015
By: Allison Gatlin
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硅谷有赖硅材料而得以蓬勃发展。但该材料的性能已经达到最高极限。有些人预见，未来将是氮化镓材料的世界。什么是氮化镓？这意味着什么？

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Semiconductor firms have announced $100.6 billion in mergers and acquisitions this year. Chip makers have long used acquisitions to obtain new technology. But many recent deals resemble consolidation waves in older industries, motivated mainly by trimming costs in areas like manufacturing, sales and engineering.

Wall Street Journal
October 18, 2015
By: Don Clark
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根据Transparency Market Research公司的全新调查报告指出，全球氮化镓半导体器件市场在2012年的营销额为三亿七千九百八十二万美元，并估计在2019年底该市场的营销达二十二亿零三百七十三万美元。根据2013年至2019的市场预测，该氮化镓半导体器件市场的年均复合增长率将达24.6%。

杂志：Industry Today
2015年10月14日
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The combination of lower on-resistance, faster switching speeds, lower thermal impedance, and smaller physical size of eGaN FETs continues to raise the bar for power transistor performance. As GaN technology matures, not only does the performance of these transistors rapidly improve, but significant reductions in cost are also realized. Not only will GaN devices continue to enable new applications, they will replace silicon power transistors in cost-sensitive applications as well. As a matter of fact, the first signs of this happening are already here.

Power Systems Design
By: Johan Strydom, Ph.D.
September 26, 2015
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In recent years, the acceleration predicted by Moore’s law has slipped. However, silicon could give way to new materials for making faster and smaller transistors.

New York Times
By: John Markoff
September 26, 2015
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电子工程界后裔Alex Lidow认为技术业界的必用材料需要改变。六十岁的Lidow现为宜普电源转换公司的首席执行官，是技术业界大力鼓吹利用氮化镓材料制造晶体管及半导体的提倡者。技术业界一直以来依靠采用传统的硅材料制造晶体管及半导体。这是一门非常获利的生意，根据代表于美国设立的公司的SIA估计，去年全球半导体业界的营收达三千三百五十八亿美元。

Fast Company
2015年9月
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The company Alex founded in 2007, called Efficient Power Conversion, or EPC, is wholly dedicated to the task of putting GaN in the forefront for use in a variety of things. Wireless power transmission, Class D audio amplifiers, (using a small circuit board, this would produce less heat, and extend battery life on portable systems); and pulsed lasers, or LiDAR (Light Distancing and Ranging), designed to quickly create 3D images useful in mapping and meteorology.

By: Bruce Rogers
Forbes
September 3, 2015
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电力的成本反映了社会经济是否发展良好。这是因为具备成本效益的电力可提高生活质素、推动全新应用的出现及业界的健康发展。氮化镓器件的出现可替代备受尊敬但日益陈旧的硅技术及解决方案，使得我们可满足社会对更高效电源的要求并带领业界的发展。

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采用无线电源充电的产品不断增多及各种移动应用采用多种不同的无线电源标准使消费者容易混淆，而且阻碍无线电源应用的普及。本章讨论可支持多种模式并工作在各种高（6.78 MHz）低（100 kHz - 315 kHz)频率的放大器拓扑。

EEWeb - Wireless & RF 杂志
2015年8月
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The trend for electronics is to continually push towards miniaturization while increasing performance. With silicon MOSFET technology fast approaching its theoretical limit, enhancement mode gallium nitride (eGaN^®) FETs from EPC have emerged to offer a step change improvement in power FET switching performance, enabling next generation power density possibilities by decreasing size and boosting efficiency. This article will explore the recommended layout techniques required to fully extract the benefits of EPC’s eGaN FETs.

By: Ivan Chan & David Reusch, Ph.D.
EEWeb –Modern Printed Circuits
August, 2015
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Wireless charging may have a standards battle to contend with, but there’s also a major a measurement problem. The quest for convenient living and energy conservation poses a ‘Ying/Yang’ dilemma living in the age of electronics. This is certainly the case with wireless power transfer technology. This rapidly emerging technology has the promise of “cutting the cord” and displacing the need for AC/DC wall adapters and perhaps eventually wall sockets. The question now is; will wireless power increase our carbon footprint by being less efficient than the traditional plug-in AC/DC wall adapters?” Are some wireless systems more efficient than others? These are two fundamental questions that need to be examined in an energy conscious world governed by energy efficient standards.

EETimes
August 4, 2015
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一种全新产品的面世有可能使检查大肠中的癌细胞好像吞下药丸般这么容易。这种技术是基于一种由宜普电源转换公司（EPC）开发的全新晶片，该晶片并没有使用硅技术 -- 它使用了氮化镓（GaN）技术。宜普公司的首席执行官Alex Lidow对Quartz谈及他们公司的晶片可以耐受Check Cap内的各个感应器所需的高电压。

Quartz
2015年7月30日
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由于PAPR比率在5G技术中会变差，氮化镓(eGaN)技术被认为是支持5G技术的基站结构在功效方面的最重要解决方案，而氮化镓功率晶体管已经实现了包络跟踪应用，我们并预期在未来的3至5年之间，当氮化镓技术继续发展，市场将会有更多的新兴应用陆续出现。

EDN
Steve Taranovich
2015年7月17日
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EPC garners the attention of MIT Technology Review with its new products targeted for wireless charging applications. Recognizing EPC as a catalyst for jump-starting the market for wireless power systems, the author highlights the need for universally accepted technology standards. He reinforces his position quoting Alex Lidow saying that “…convenience, cost, and efficiency” are all factors needed for broad adoption of any standard…

MIT Technology Review
July 15, 2015
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全新EPC2107及EPC2108 eGaN^®功率集成电路包含单片半桥式器件及集成式自举功能，专为符合无线充电联盟（A4WP）第二及第三级规范的解决方案而设。此外，为了让客户容易对氮化镓元件进行评估，我们也提供开发板及包含发射器及接收器的无线电源传送解决方案。

宜普电源转换公司（EPC）宣布推出内含集成式自举功能的场效应晶体管的eGaN半桥功率集成电路 EPC2107（100 V）及EPC2108（60 V）。该集成电路去除了由栅极驱动器所引致的反向恢复损耗，也不需高侧箝位。这是首次在eGaN功率电路中集成了一个自举场效应晶体管。

Consumers want to be able to go wirelessly where they want, when they want. They want televisions to be seamlessly synchronized with tablets, phones, laptops, and automobiles. They want all their communication, information, and entertainment to be available immediately, with high resolution, all the time. Recently the automobile industry has caught on to this trend and has begun to show its vision of the future for the fully mobile lifestyle.

Consumers also do not want to worry about running out of battery life – no more looking for an open outlet at the airport. This untethered life is the Mobility Imperative and it is driving innovation in consumer products, which in turn, is pushing the limits of silicon-based semiconductor technology.

Nikkei Business Publications
July 10, 2015
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