EPC技术文章

面向多种功率应用的氮化镓晶体管

硅功率MOSFE追不上目前功率电子业界的演进步伐 -- 业界需要具备高效、高功率密度及细小的外型尺寸的器件。业界看到硅MOSFET已经达到它的理论极限,从而需要找出全新器件。氮化镓(GaN)是一种HEMT器件,具备附加增值的优势,被证明为可以支持全新应用的要求。

Power Electronics News
2020年3月25日
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Just How Fast is GaN Fast?

A recent design for an ultra-high speed, low-impedance pulse generator to evaluate oscilloscope probe performance and for determining the feasibility of an in-socket load for ASIC emulation using EPC eGaN™ FET, EPC2037 reveals just how fast these power devices are.

Signal Integrity
March 12, 2020
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测试氮化镓器件在何时开始失效

从2010年3月起,氮化镓(GaN)功率器件已经实现高可靠性并进行量产。本章详细阐析如何测试出器件在何时开始失效,从而了解数据手册给出的器件工作条件,距离其工作极限值还有多少余量。而最重要的是,找出器件固有的失效机理,了解其失效的根本原因、恒常操作情况、温度、电气应力或机械应力等,从而找出产品在一般工作条件下,它的安全使用寿命。

Power Systems Design
2020年3月
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氮化镓(GaN)技术的最新发展是什么?

著名企业领袖 - 宜普电源转换公司(EPC)首席执行官Alex Lidow于2009年在市场推出第一个氮化镓晶体管。 经过了10年的氮化镓产品销售,DESIGN & ELEKTRONIK 杂志编辑Ralf Higgelke与Alex会面并谈论氮化镓技术的最新发展。

DESIGN & ELEKTRONIK杂志
2020年2月20日
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采用GaN技术的电源转换

当硅技术已经到了性能极限,采用氮化镓器件的全新设计使得氮化镓技术得以继续普及。氮化镓器件的发展还是刚刚起步,它的性能将得以继续提升、集成电路也将会更具优势,以及将有更多全新的氮化镓产品推出市场。

Electronics Weekly
2019年12月
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Go-Ahead for GaN

Smaller, faster, lower cost, and more integrated, GaN-on-Silicon devices have the confidence of designers across a spectrum of power conversion applications. In this article, Alex Lidow explains why it’s getting harder to avoid using GaN power transistors and ICs.

Electronic Specifier
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无线电源在线硏讨会:为什么氮化镓器件在符合AirFuel标准的共振式无线电源应用中,可以提升效率、缩小尺寸及降低成本?

宜普电源转换公司首席执行官Alex Lidow 在是次硏讨会讨论氮化镓技术如何大大改善系統的效率、尺寸及成本,从而加快磁共振及AirFuel共振技术的普及。

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Go-ahead for GaN

It’s getting harder to avoid using GaN power transistors and ICs, says Alex Lidow. There are many reasons to use GaN-on-Si power transistors such as eGaN FETs, in telecoms, vehicles, healthcare and computing. Smaller, faster, lower cost, and more integrated, GaN-on-Si devices have spent a decade gaining the confidence and trust of designers across the spectrum of power conversion applications.

Electronic Specifier
November 20, 2019
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Qualifying and Quantifying GaN Devices for Power Applications

It’s okay to start using gallium-nitride (GaN) devices in your new designs. GaN transistors have become extremely popular in recent years. These wide-bandgap devices have been replacing LDMOS transistors in many power applications. For example, GaN devices are broadly being adopted for new RF power amplifiers used in cellular base stations, radar, satellites, and other high-frequency applications. In general, their ability to endure higher voltages and operate at frequencies well into the millimeter-wave (mmWave) range have them replacing traditional RF power transistors in most amplifier configurations.

Electronic Design
November, 2019
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GaN in Space

This article discussed an oft forgotten or little-noticed part of the spacecraft enabling travel into outer space---power management in the space vehicle. Wide bandgap semiconductors like gallium nitride (GaN), silicon carbide (SiC), as well as diamond, are looking to be the most promising materials for future electronic components since the discovery of silicon. These technologies, depending upon their design, offer huge advantages in terms of power capability (DC and microwave), radiation insensitivity, high temperature and high frequency operation, optical properties and even low noise capability. Therefore, wide bandgap components are strategically important for the development of next generation space-borne systems. eGaN devices are quickly gaining momentum in the space industry and we will see many more applications for them by NASA and commercial contractors in future programs like Artemis and other programs in countries around the globe pursuing efforts into Space.

Power Systems Design
November, 2019
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Executive Interview with Alex Lidow on Winning GaN Applications

Ahead of December’s Power Conference in Munich, Bodo Arlt took the opportunity to get an insight into Alex Lidow’s thoughts on where the GaN market is now and where he sees the potential applications for the future. Dr. Lidow is the CEO and Co-founder of Efficient Power Conversion (EPC).

Bodo’s Power Systems
November, 2019
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功率半导体战争开始了

氮化镓(GaN)及碳化硅(SiC)器件的价格下调,对客户而言,更为吸引。多家供应商推出基于氮化镓及碳化硅的功率半导体,摩拳擦掌,正在爆发新一轮的半导体大战,全速进攻传统硅基器件的市场份额。

Semiconductor Engineering
2019年10月
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氮化镓技术正在改造医疗护理

氮化镓技术为业界实现以前不可能达到的目标。EPC公司的Alex Lidow阐析医疗护理如何更好地利用氮化镓技术,实现重大的改进。

Electronic Specifier
2019年8月
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DC-DC Conversion for 48 V – 12 V Automotive Applications

GaN transistors, with favorable figures of merit (FOM) for 48 V applications, can provide a reduction in size, weight, and bill of material costs. This article presents a five-phase, fully regulated, bidirectional 48 V to 12 V DC-DC converter. An advancedthermalmanagement solution suitable for use with eGaN FETs results in a system that can provide 3kW of power at an efficiency exceeding 97.5% into a 14.5 V battery.

Power Systems Design
July, 2019
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GaN Powers Small Satellites

Small satellites bring a more cost-effective approach to low-Earth-orbit (LEO) missions, helping to deliver low-cost internet access across the globe. For this application, GaN FETs partnered with a radiation tolerant pulse width modulation controller and GaN fet driver allow more efficient switching, higher frequency operation, reduced gate drive voltage and smaller solution sizes compared to the traditional silicon counterparts.

Electronics Weekly
July, 2019
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数据中心的发展于2019年将进入突飞猛进的时代

根据预测,到2025年,我们的数据将会超过175 zettabyte。当发明了 5G并将最早于2020年在日本举行的奥运采用、以及通过人工智能(AI)及机器学习(ML)的发展,建立数据中心和其部署、以及提升目前较旧的数据中心的效能,将进入突飞猛进的时代。

我深信氮化镓(GaN)功率晶体管是数据中心功率架构的最理想元件,因为需要小型化、高效及快速开关的元件。氮化镓器件在具48 VIN的所有拓扑,都可以实现最高的效率。

EDN
2019年6月
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氮化镓正面攻击硅功率MOSFET器件

目前的氮化镓场效应晶体管在尺寸及性能方面以飞快的速度发展,而目前为业界树立基准的氮化镓器件的性能还可以提升多300倍。

最早采用氮化镓器件的应用是利用氮化镓的超快速开关速度,例如面向全自动驾驶汽车和无人机的激光雷达系统、机械人,以及4G/LTE基站。氮化镓器件的产量一直在增加,而其价格跟开关速度更慢、尺寸更大型和日益陈旧的MOSFET器件相约。因此,目前正是氮化镓器件正面攻击MOSET的时候!。

Bodo’s Power System
2019年6月
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Thermal design for a high density GaN-based power stage

eGaN FETs and ICs enable very high-density power converter design, owing to their compact size, ultra-fast switching, and low on-resistance. The limiting factor for output power in most high-density converters is junction temperature, which prompts the need for more effective thermal design. The chip-scale packaging of eGaN FETs and ICs offer six-sided cooling, with effective heat extraction from the bottom, top, and sides of the die. This article presents a high-performance thermal solution to extend the output current capability of eGaN-based converters.

EDN
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The Amazing New World of Gallium Nitride

From the heart of Silicon Valley comes a new buzzword. Gallium nitride is the future of power technology. Tech blogs are touting gallium nitride as the silicon of the future, and you are savvy enough to get in on the ground floor. Knowing how important gallium nitride is makes you a smarter, better consumer. You are at the forefront of your peer group because you know of an up and coming technology, and this one goes by the name of gallium nitride.

HACKADAY
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EPC: Ahead of the Pack

EPC's chief executive, Alex Lidow, believes his GaN devices now beat silicon on performance and price, reports Rebecca Pool.

For EPC chief executive, Alex Lidow, this year's PCIM Europe 2019 has been all about applications. Presenting myriad enhanced-mode GaN FETs and ICs in end-products, the company is making a big play for 48 V DC-DC power conversion in advanced computing and automotives.

Compound Semiconductor
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