Microinverters and power optimizers are widely utilized in modern solar panels to maximize energy efficiency and conversion. Such topologies and implementations usually require a minimum of 25 years of lifetime, which is becoming a critical challenge for market adoption. Low-voltage gallium nitride (GaN) power devices (VDS rating < 200 V) are a promising solution and are being used extensively by an increasing number of solar manufacturers.

In this article, a test-to-fail approach is adopted and applied to investigate the intrinsic underlying wear-out mechanisms of GaN transistors. The study enables the development of physics-based lifetime models that can accurately project the lifetimes under the unique demands of various mission profiles in solar applications.

How2Power
August, 2023
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Transient voltage overshoot is a common phenomenon in GaN high electron mobility transistors (HEMTs) under high slew rate switching conditions. The dynamic parametric instability under such stress is a critical concern for GaN applications. This work, for the first time, accurately characterized the evolution of dynamic on-resistance (R_DS(on)) in GaN HEMTs under repetitive voltage overshoot up to billions of switching cycles. The dynamic R_DS(on) increase was found to be the dominant device degradation under overvoltage switching. Such findings were obtained from a high-frequency, repetitive, unclamped inductive switching (UIS) test with active temperature control and accurate in-situ R_DS(on) monitoring. A physics-based model was proposed to correlate the dynamic R_DS(on) drift with the peak overvoltage, and a good agreement with experimental data was achieved. This model was further used to project the lifetime of GaN HEMTs. For 100 V rated GaN HEMTs switched under 100 kHz and 120 V spikes, the model projects less than 10% dynamic R_DS(on) shift over 25 years of continuous operation. This work addresses the major concerns of overvoltage switching reliability of GaN HEMTs and provides new insights of the electron trapping mechanism.

IEEE Xplore
Ruizhe Zhang, Ricardo Garcia, Robert Strittmatter, Yuhao zhang, Shengke Zhange
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In this episode of Spirit: Behind the Screen, Spirit Electronics CEO Marti McCurdy chats with EPC’s CEO Alex Lidow and Marketing Director Renee Yawger about the progress of GaN. They discuss GaN’s performance under high radiation as well as the extensive testing, failure modes and device lifespan detailed in EPC’s Phase 15 reliability report. With the full potential of GaN still to be explored and new EPC products releasing frequently, including new half-bridge drivers, low-side drivers and full power stage, GaN is especially useful in New Space and commercial space applications.

Spirit: Behind the Screen
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Modern solar panels are demanding increasingly higher power density and longer operating lifetimes. Solar applications including power optimizers and panels with built-in microinverters are becoming the prevailing trend for an increasing number of solar customers, where low voltage GaN power devices (V_DS < 200 V) are extensively used.

Bodo’s Power Systems
May, 2023
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A few simple thermal management guidelines can help conduct heat away from GaN FETs. Enhancement-mode gallium nitride (eGaN) FETs offer high power-density with ultra-fast switching and low on-resistance, all in a compact form factor. However, the power levels these high-performance devices provide can be limited by extreme heat-flux densities. If not managed properly, the generated heat can compromise reliability and performance. Fortunately, chip-scale packaging for eGaN FETs can be leveraged at the board-side and the backside (i.e., case) to better dissipate heat.

Power Electronics Tips
February, 2022
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由 Bodo Power Systems 主辦的氮化鎵行業專家圓桌會議的嘉賓包括：

1. EPC公司的首席執行長兼共同創始人Alex Lidow
2. Power Integrations公司的市場行銷與應用工程副總裁Doug Bailey
3. Nexperia 公司的氮化鎵功率技術行銷戰略總監Dilder Chowdhury
4. Navitas Semiconductor公司的市場行銷戰略高級總監Tom Ribarich

最近，EPC公司對其氮化鎵場效應電晶體（eGaN FET）進行了一系列測試，把它置於超出數據手冊的限值下工作，從而量化和發表這些元件通過電壓和電流極端應力測試的結果。

Bodo’s Power Systems
2021年5月
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Enhancement-mode gallium nitride (eGaN) FETs have demonstrated excellent thermomechanical reliability in actual operation in the field or when tested according to AEC or JEDEC standards. This is because of the inherent simplicity of the “package,” the lack of wire bonds, dissimilar materials, or mold compound. Recently, an extensive study of underfill products was conducted to experimentally generate lifetime predictions. A finite element analysis at the end of this section explains the experimental results and generates guidelines for selection of underfill based on key material properties.

Bodo's Power
March, 2021
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In last month’s Safety & Compliance column in How2Power, “WBG Semiconductors Pose Safety And EMI Challenges In Motor Drive Applications,”[1]Kevin Parmenter made some assertions about the difficulties of using SiC, and to a lesser extent GaN, power semiconductors in large motor-drive applications. This commentary is a response to that article, showing that GaN can be a game changer in low-voltage integrated motors.

How2Power
February, 2021
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Standard qualification testing for semiconductors typically involves stressing devices at-or-near the limits specified in their data sheets for a prolonged period of time, or for a certain number of cycles. The goal of qualification testing is to have zero failures out of a large group of parts tested. By testing parts to the point of failure, an understanding of the amount of margin between the data sheet limits can be developed, but more importantly, an understanding of the intrinsic failure mechanisms of the semiconductor can be found.

IEEE Power Electronics Magazine
December, 2020
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An automotive application using GaN power devices in high volume is lidar(light detection and ranging) for autonomous vehicles. Lidar technology provides information about a vehicle’s surroundings, thus requiring high accuracy and reliability to ensure safety and performance. This article will discus a novel testing mechanism developed by EPC to test eGaN devices beyond the qualification requirements of the Automotive Electronics Council (AEC) for the specific use case of lidar.

Power Systems Design
December, 2020
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Gallium nitride (GaN) power devices have been in volume production since March 2010 and have established a remarkable field-reliability record. An automotive application using GaN power devices in high volume is lidar (light detection and ranging) for autonomous vehicles. Lidar technology provides information about a vehicle’s surroundings, thus requiring high accuracy and reliability to ensure safety and performance. This article will discuss a novel testing mechanism developed by Efficient Power Conversion (EPC) to test eGaN devices beyond the qualification requirements of the Automotive Electronics Council (AEC) for the specific use case of lidar.

eeNews Europe
July 30, 2020
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這些元件為什麼越來越受歡迎？還有什麼方面需要改善的？氮化鎵(GaN)和碳化矽(SiC)功率元件的製造商將推出下一代具備全新性能和高規格的產品。但是，在系統中採用這些元件之前必需證明它們是可靠的。

Semiconductor Engineering
2020年6月
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從2010年3月起，氮化鎵（GaN）功率元件已經實現高可靠性並進行量產。本章詳細闡析如何測試出元件在何時開始失效，從而瞭解數據手冊給出的元件工作條件，距離其工作極限值還有多少餘量。而最重要的是，找出元件固有的失效機理，瞭解其失效的根本原因、恒常操作情況、溫度、電氣應力或機械應力等，從而知道產品在一般工作條件下，它的安全使用壽命。

Power Systems Design
2020年3月
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It’s okay to start using gallium-nitride (GaN) devices in your new designs. GaN transistors have become extremely popular in recent years. These wide-bandgap devices have been replacing LDMOS transistors in many power applications. For example, GaN devices are broadly being adopted for new RF power amplifiers used in cellular base stations, radar, satellites, and other high-frequency applications. In general, their ability to endure higher voltages and operate at frequencies well into the millimeter-wave (mmWave) range have them replacing traditional RF power transistors in most amplifier configurations.

Electronic Design
November, 2019
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氮化鎵技術已經成熟至可以挑戰傳統的矽技術。從2010年起，商用的低壓矽基氮化鎵功率元件實現了很多全新應用。具備高速開關性能的氮化鎵元件也推動了全新市場的出現，例如雷射雷達、波峰追蹤及無線電源市場。這些全新應用有助供應鏈的開發、實現低製造成本及良好的元件可靠性記錄。這一切對於比較保守的DC/DC轉換器、AC/DC轉換器及車載應用的設計工程師來說，是很好的理據，是時候開始對氮化鎵元件進行評了。本文探討加快採納氮化鎵元件的各項因素。

Electronics Weekly
2019年1月
文章連結

專為高效電源轉換而設的氮化鎵功率電晶體已經投產7年多了。全新的市場例如雷射雷達、波峰追蹤及無線電源，都成為氮化鎵的新興市場，因為氮化鎵具備超高速的的開關速度。這些市場使得氮化鎵產品得以量產、成本更低及具備優越的可靠性。這些優勢為比較保守的設計工程師提供更大的利好條件，因此，DC/DC轉換器工程師、AC/DC轉換器及車載應用工程師都開始對氮化鎵器件進行評估。要把120億美元的矽基MOSFET市場轉為氮化鎵市場，還有什麼壁壘呢？就是信心的問題。設計工程師、製造工程師、採購經理及管理層都必需對氮化鎵技術的優勢有足夠的信心、相信氮化鎵技術可以解決設計師對採用全新技術的風險的疑問。讓我們看看3個主要構成風險的因素：供應鏈、成本及產品的可靠性。

IEEE Spectrum
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本系列的第四章中，我們探討了採用晶圓級晶片尺寸封裝的eGaN元件的熱機械可靠性。同樣重要的是，我們需要瞭解有閘極偏置時，元件有可能發生的故障模式。本章探討氮化鎵（GaN）場效應電晶體的閘極在偏置電壓時失效的物理原因。我們把eGaN FET的閘極控制電壓提升至特定的最大極限值和極限值以上，從而分析該元件在失效前的性能。

Planet Analog
Chris Jakubiec
2016年11月29日
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在本系列的第一、二及第三章中，我們詳細講解了關於EPC增強型氮化鎵場效應電晶體(eGaN FET)及積體電路(IC)的現場可靠性及它們被認證通過應力測試。在應用中，我們把元件置於預期的工作條件下並施加應力，其測試結果引證了氮化鎵元件的現場可靠性。同樣重要的是明白eGaN元件固有的物理特性，它如何在被施加應力後並超出預期工作條件時（例如數據表的參數及安全工作區(SOA)）而失效。本章將進一步深入探討失效的物理原因 -- 採用晶圓級晶片尺寸封裝（WLCSP）的eGaN元件的熱機械可靠性。

Planet Analog
Chris Jakubiec
2016年9月7日
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