EPC Wafer Sales

EPC is pleased to offer our development partners the option of procuring EPC enhancement-mode gallium nitride (GaN) devices in wafer form for ease of integration. A variety of additional available services is detailed below. If you have specific requirements not addressed below, please contact us at [email protected]

EPC GaN Wafers

Wafer Sales and Services

  • Bumped wafers
  • Wafers without solder bumps
    • Under Bump Metal (UBM): 10 μm PI + 2 Ka Ti sputter + 4 Ka Cu sputter + 8 μm Cu plating
    • Under Bump Metal (UBM): 10 μm PI + 2 Ka Ti sputter + 4 Ka Cu sputter + 5 μm Cu/3 μm Ni plating
  • Extra services available per wafer
    • Wafer thinning down to 260 μm
    • Metallization of the wafer backside
      • Ti/Ni/Au
      • Ti/Ni/Ag
    • Backside coating tape

For information on pricing and availability please contact your local sales representative or EPC at [email protected]

Download wafer sales brochure

EPC Wafer Sales