Communications GaN Applications

AC/DC Conversion

GaN Increases Efficiency, Reduces Size, Cooler Operation

AC/DC power supplies

The lower switching losses of GaN enable higher switching frequencies and higher power densities compared to silicon-based designs. This allows for the use of smaller passive components which provide a design that is more compact and lighter.

Despite the small size, GaN FETs and ICs offer better thermal performance compared to silicon.

GaN AC/DC Communications

Reference Designs

Communications AC/DC Reference Designs

Part Number Description VIN VOUT lOUT
(A)		 FSW
(kHz)		 Featured Product  
PMP20978 Demonstration Board
 PMP209781 kW Resonant Converter with GaN Sync Rectification390 V48 V21 A EPC2033 Contact TI

EPC’s application team is constantly working on new reference designs. If there is a requirement not met by the listed boards, please contact us via Ask a GaN Expert to discuss your application further.

Half-bridge development boards are available for quick evaluation of most eGaN FETs and ICs.

Products

Recommended Devices for Communications AC/DC Conversion

Part Number Status Configuration VDS
max		 VGS
max		 max
RDS(on)
(mΩ)
@5VGS		 QG
typ
(nC)		 QGS
typ
(nC)		 QGD
typ
(nC)		 QOSS
typ
(nC)		 ID (A) Pulsed ID
(A)		 Package
(mm)
EPC2371 Engr Single 25 6 17 5 2 18 88 412 QFN 3.3 x 2.6 Contact EPC
EPC2378 Engr Single 25 6 0.5 34 10.4 1.6 26 101 699 QFNb 3.3 x 3.3 Contact EPC
EPC2306 Preferred Single 100 6 3.1 12.3 4.3 1.1 44 63 197 QFN 3 x 5 Buy Now
EPC2302 Preferred Single 100 6 1.8 23 8.9 2.3 85 133 408 QFN 3 x 5 Buy Now
EPC2367 Preferred Single 100 6 1.5 17 5.3 2.4 54 101 420 QFN 3.3 x 3.3 Buy Now
EPC2361 Preferred Single 100 6 1 28 8.5 3.8 90 133 697 QFN 3 x 5 Buy Now
EPC2305 Preferred Single 150 6 3 22 6.6 2.1 103 133 329 QFN 3 x 5 Buy Now
EPC2307 Preferred Single 200 6 10 10.1 3.5 1.2 58 63 130 QFN 3 x 5 Buy Now
GaN Power Bench

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