EPC’s GaN FETs and ICs are offered in chip-scale packaging (CSP) and Plastic Quad Flat No-Lead (PQFN) packaging. The choice between CSP and PQFN depends on the specific requirements of the application. CSP is well-suited for size-constrained, high-power density applications. PQFN packages offer a balance between high performance and ease of manufacturing.
Benefits of Chip-Scale Packaging
- Size and space efficiency
- Lower parasitic capacitance and inductance
- Efficient heat dissipation from all sides of the chip
Benefits of Plastic Quad Flat No-Lead
- Simple manufacturing
- Low thermal resistance
- Footprint compatibility