Assembly Resources

eGaN^® FETs enable a new state-of-the-art in power conversion efficiency. One of the contributors to this new performance benchmark is that these FETs are in chipscale Land Grid Array (LGA) and Ball Grid Array (BGA) packages. The format of these packages reduce board space, stray inductance, and parasitic resistance. The following resources discuss how to reliably mount these packages on to a printed circuit board.

• Enhancement Mode GaN FETs and ICs Visual Characterization Guide
• Designing PCB Footprint for EPC eGaN FETs and ICs
• How to Manually Assemble an eGaN FET or IC
• Assembling eGaN FETs
• Solder Stencil Design Guidelines for Reliable Assembly of PQFN GaN Devices
• Quick Reference - Die Attach Procedure
• Quick Reference - Die Removal Procedure