Assembly Resources

eGaN® FETs enable a new state-of-the-art in power conversion efficiency. One of the contributors to this new performance benchmark is that these FETs are in chipscale Land Grid Array (LGA) and Ball Grid Array (BGA) packages. The format of these packages reduce board space, stray inductance, and parasitic resistance. The following resources discuss how to reliably mount these packages on to a printed circuit board.

eGaN FETs from EPC provide designers employing any power conversion topology; full bridge, half bridge, buck converter, boost converter, PFC, flyback converter, forward converter, or LLC converter the opportunity to achieve significant performance enhancements compared with silicon power MOSFETs.