GaN First Time Right™ Design Process

To ensure high reliability and to extract maximum performance from eGaN devices, it is important to follow some simple PCB design and assembly guidelines. The details of these guidelines for chip scale packages is presented in Assembling eGaN FETs and Integrated Circuits.

When starting a new production process, it is common to set up incoming visual inspections. To simplify this process, detailed descriptions of the EPC FETs and ICs physical characteristics including the visual criteria all devices must meet before they are released for shipment to customers are given in the Enhancement Mode GaN FETs and ICs Visual Characterization Guide

For additional information on assembly guidelines, visit our page Assembly Resources.