How to GaN Webinar Series

How2GaN Summer Series

Thermal Management of GaN FETs

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In the final installment of the four-part How2GaN Summer Series, our GaN Experts will focus on thermal management techniques to maximize the performance of GaN FETs and ICs. Topics covered include:

  • Thermal resistance device comparisons
  • The impact of using PCB only for heat spreading
  • Heat-spreader/sink attach overview
  • Thermal performance improvements with heat-spreader/sink

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Brian Miller

Presenter: Brian Miller joined EPC in 2015, where he is the field applications engineer for eastern North America. He has over 30 years of experience in power electronics, as a design engineer and as a field application engineer. At IBM and Sony Ericsson he designed small, efficient power supplies and battery chargers for laptops, tablets, and other equipment, and designed a custom analog controller IC for laptop dc-dc and battery charging. Previous to EPC, Brian was a field application engineer for Semtech, where he was involved in designs for AC-DC, DC-DC, LED lighting, and other areas. He has authored patents, articles, and talks. Brian received his MSE and BS degrees from Duke University in Durham, N. Carolina.

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Thermal Management of GaN FETs

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