The continued adoption of Efficient Power Conversion (EPC) Corporation’s eGaN® devices necessitates additional reliability data to prove capability over many applications. The Phase 9 reliability report adds to the growing knowledge base that has been previously published in EPC’s first eight reports. The main section of this report covers thermo-mechanical board level reliability, focusing on a predictive model for solder joint integrity. Appendix A provides details of the method to calculate solder joint strain energy density during thermal cycling, as is referenced in the report. Appendix B contains cumulative product specific stress test data from previously published reliability reports, as well as data collected after the Phase 8 report was released.
Chris Jakubiec, Rob Strittmatter Ph.D., and Chunhua Zhou Ph.D., Efficient Power Conversion Corporation