EPC APEC 2024

Meet with the GaN Experts at APEC 2026!

Join EPC at the Applied Power Electronics Conference (APEC) from March 22-26, 2026 in San Antonio, Texas! At APEC, EPC is proud to showcase the industry’s most comprehensive portfolio of Gallium Nitride (GaN) power conversion solutions that are revolutionizing the way we live.

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Explore Our Booth (#1935)

Visit EPC’s booth to explore the company’s comprehensive portfolio of GaN-based solutions and experience live demonstrations highlighting performance, density and efficiency advantages.

To support customer development, EPC will showcase a range of available reference platforms including motor drive inverters, humanoid joint controllers, multi-device power stages and high-density DC-DC conversion boards. Examples include the EPC9176 and EPC91104 motor drive boards, the EPC9186 multi-device inverter, humanoid joint platforms EPC91118 and EPC91120, and power conversion solutions such as the EPC91200, EPC9196 and EPC9193 series. These designs illustrate real implementation paths already used in customer programs across robotics, drones and high-performance computing. Reference designs will be presented as development tools supporting adoption, while the focus remains on production-ready devices enabled by the company’s Gen 7 platform.

EPC91123 ISOP

Engage with Our Experts

Schedule a Meeting: EPC’s technical experts, including CEO Dr. Alex Lidow, will be on-site to discuss how GaN is enabling innovation across AI infrastructure, robotics and high-density power systems. To schedule a meeting during APEC 2026, contact [email protected].

Exhibition Booth #1935: Visit EPC’s booth to explore the company’s comprehensive portfolio of GaN-based solutions and experience live demonstrations highlighting performance, density and efficiency advantages.

LIVE Technical Presentations:

Join our LIVE technical presentations at the EPC Booth (#1935)

Tuesday, March 24 | 10:30–11:10 am

GaN Beats MOSFETs at All Voltages

Alex Lidow, CEO, Efficient Power Conversion (EPC)

Server architectures are evolving rapidly to meet the extreme power demands of artificial intelligence. Nvidia’s new 800 VDC requirements for Vera Rubin–class AI servers, combined with power levels reaching up to one megawatt per rack, are driving the need for new device technologies and power conversion architectures. EPC has developed GaN devices that set new benchmarks across the entire 800 VDC power chain - from the 800 V input down to the point of load - surpassing the performance of any MOSFET ever developed and defining the future of AI power systems.

Leveraging Test-to-fail Methodology to Ensure Reliable Field Operation of GaN Devices

Shengke Zhang, Vice President of Product Reliability, Efficient Power Conversion (EPC)

GaN transistors and ICs have gained significant traction as an emerging technology for advanced applications such as LiDAR, AI data centers, humanoid robots, and space systems. The robustness and stability of GaN devices are key factors for the widespread adoption of this technology. EPC has developed a test-to-fail methodology to quantitatively model device lifetimes under various mission-specific operating conditions. The results demonstrate the excellent reliability robustness and stability of EPC’s eGaN technology under field operation.

Tuesday, March 24 | 2:30–3:10 pm

GaN Inverters Reference Designs for Humanoid Robot Motor Joints

Marco Palma, Director, Motor Drives Systems and Applications, Efficient Power Conversion (EPC)

Humanoid robots are seeing strong market growth across a wide variety of applications. The key market segments for humanoid robots are industrial automation, warehouses, household assistance and healthcare and agriculture. According to Goldman Sachs research, the global shipment of humanoid robots in 2025 was between 15,000 and 20,000 units and a strong Cumulative Annual Growth Rate (CAGR) of over 40% is expected over the next decade. Motor control forms a key design aspect in robotics, and in this presentation, we summarize the basic motor joints architecture and related requirements for the power electronics, along with examples of motor drive reference designs available from Efficient Power Conversion Corporation (EPC).

800 V to 12 V AI Servers using Low-Voltage GaN in an ISOP Converter

Michael de Rooij, GaN Applications Fellow, Efficient Power Conversion (EPC)

Next generation 800 V server rack architectures, driven by AI, have increased the competition between computing hardware and power supplies for rack space thus encouraging the adoption of new high-efficiency, high-power-density conversion topologies. The Input Series Output Parallel (ISOP) has emerged as a leading candidate that can meet the efficiency and power-density demands for these servers. EPC has developed a 8-LLC-module, 6 kW, 800 V to 12.5 V isolated ISOP converter using 150 V and 40 V rated GaN FETs only, that fits in a volume of just 47 x 106 x 8 mm. This presentation will provide details of the design, experimental results and cover the benefits of using 8-modules over alternative approaches.

Conference presentations

  • End-to-End With GaN from EPC – Alex Lidow, CEO of EPC — Tue, March 24, 1:30 pm — Room 217B — Exhibitor Seminar
  • Reliability Investigation of p-GaN Gates in GaN HEMTs Under Dynamic Switching Conditions – Angel E. Espinoza, Test Engineer, EPC — Tue, March 24, 9:30–9:50 am — Technical Session (T04 GaN Devices). Room: 214D
  • ISOP LLC Converter with Integrated Magnetics for Server Power Supplies – Alejandro Pozo, Director of Applications Engineering, EPC — Tue, March 24, 11:40–12:00 pm — Technical Session (T03 Data Centers). Room: 214C
  • A Novel Three-Phase Power Micro-Module for Robotic Hands – Marco Palma, Director, Motor Drives Systems and Applications, EPC — Wed, March 25, 9:20–9:45 am — PSMA Session (IS07.3). Room: 206
  • Compact GaN-Based 5 kW Four-Level Totem-Pole PFC Converter – Marco Palma, Director, Motor Drives Systems and Applications, EPC — Wed, March 25, 3:40–4:05 pm — Industrial Session (IS16.5). Room: 207
  • Mission Profile-Driven Reliability Assessment of Leading-Edge GaN for AI Data Center Applications – Shengke Zhang, VP of Product Reliability, E — Thu, March 26, 8:20–8:45 am — PSMA Session (IS23 Reliability: From Stress to Strength). Room: 210

Exclusive Sessions

Schedule a private meeting during APEC 2026. Learn from our GaN Experts, get hands-on experience with our products, and discover strategies to optimize your power systems.

Schedule a meeting with our team of GaN Experts

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