Assembly Resources

eGaN FETs enable a new state-of-the-art in power conversion efficiency. One of the contributors to this new performance benchmark is that these FETs are in a chipscale Land Grid Array (LGA) package. This package format reduces board space, stray inductance, and parasitic resistance. The following resources discuss how to reliably mount these LGA packages on to a printed circuit board.

eGaN FETs from EPC provide designers employing any power conversion topology; full bridge, half bridge, buck converter, boost converter, PFC, flyback converter, forward converter, or LLC converter the opportunity to achieve significant performance enhancements compared with silicon power MOSFETs.