GaN Reliability Solar Webinar

GaN Reliability in Real-World DC-DC Applications Webinar

Using Test-to-Fail Methodology to Accurately Predict Projected Lifetime of eGaN® Devices in Common DC-DC Converter Topologies

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The reliability of DC-DC converters is essential for maintaining system performance, ensuring safety, minimizing costs and downtime, and promoting longevity and sustainability. This webinar will provide you with valuable insights and practical knowledge about the reliability of Gallium Nitride (GaN) technology in various DC-DC converter topologies.

During this webinar, we will explore the cutting-edge Test-to-Fail methodology and its significance in precisely predicting the projected lifetime of eGaN devices in some of the most common DC-DC converter topologies.

Join the webinar to learn more about:

  1. An introduction to GaN technology and its advantages in common DC-DC converter topologies including a synchronous rectifier and a buck converter.
  2. In-depth exploration of the Test-to-Fail methodology and its applicability in accurately forecasting device lifetimes.
  3. Applying the Test-to-Fail methodology to a synchronous rectifier and a buck converter, considering both the high-side and low-side FETs.
  4. Question and answer session to address your specific queries and concerns.

After registering, you will receive a confirmation email containing information about accessing the recorded webinar.

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Shengke Zhang.png

Speaker: Dr. Shengke Zhang is Vice President of Product Reliability at EPC, where he leads the conduction of failure analyses for all GaN transistors and ICs. Prior to joining EPC, he worked as Sr. Failure Analysis Engineer on RF-MEMS devices in the mobile industry. He earned his Ph.D. degree in Materials Science and Engineering from Arizona State University in 2016, under Dr. Nathan Newman, in investigating low-loss dielectrics for cellular and advanced computing applications. He received his B.S. degree from Huazhong University of Science and Technology 2011. He was the author and co-author of more than 20 technical papers. He is also a committee member and internal liaison for JEDEC's JC-70 Wide Bandgap Power Electronic Conversion Semiconductors Committee.

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GaN Reliability in Real-World DC-DC Applications

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