Class D Audio Amplifiers

Class D Audio Amplifiers

Pump up the VOLUME! The lower power dissipation of Class-D audio systems produce less heat, save circuit board space and cost, and extend battery life in portable systems.

In Class-D audio systems, the audio performance is impacted by the FET characteristics. GaN FETs enable higher fidelity Class-D audio amplifiers.

The low on resistance and low capacitance of the eGaN® FET enables high efficiency and lowers open loop impedance for low Transient Intermodulation Distortion (T-IMD). The fast switching capability and zero reverse recovery charge enable higher output linearity and low cross over distortion for lower Total Harmonic Distortion (THD).

Application Brief – eGaN FETs for Class-D Audio

Panasonic breathes new life into Technics – features GaN for high speed switching

Why We'll Soon Be Living In A Class-D World

Class-D Audio Reference Material

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Class D Audio Amplifiers

Technics uses eGaN FETs
In the speaker-driver section, Panasonic has employed high speed GaN devices from EPC in their Technics’ amplifier

Class-D audio Reference Designs

Part
Number 		Description Output Power Frequency Response
KS25-3WBAEVALZ 3-in-1 smart speaker reference design 100 W x 1 + 25 W x1 into 8 ohms 20Hz to 20kHz, +/-0.5dB Contact Renesas
EPC9106 Class-D audio amplifier 150 W / 8 Ω 20 Hz – 20 kHz, ±0.5 dB Contact EPC
eGaNAMP 2.1 Class-D audio amplifier platform 200 W/ 8 Ω 10 Hz – 20 kHz, ±0.5 dB Contact EAS
eGaNAMP2016 Class-D audio amplifier module 200 W/ 8 Ω 10 Hz – 20 kHz, ±0.5 dB Contact EAS

ePower™ Stage

Part
Number 		Configuration Nominal
Logic Supply
Voltage (V) 		Max.
Input Voltage
(V) 		Typ.
RDS(on)
(mΩ) 		Rated Output
Current
(A) 		Features Fault
Protection 		Max.
TJ
(°C) 		Package
(mm) 		Development
Board
EPC2152 Half-Bridge
ePower™ Stage		 12 70 10 12.5 Level shifting,
Bootstrap circuits		 UVLO 150 LGA 3.65 x 2.59 EPC90120

Recommended Devices for Class-D Audio Designs

Part
Number 		Configuration VDS Max
RDS(ON)
(mΩ)
(VGS = 5 V) 		QG
typ
(nC) 		QGS
typ
(nC) 		QGD
typ
(nC) 		QOSS
typ
(nC) 		Max. Peak Pulsed ID(A)
(25°C, Tpulse = 300µs) 		Package
(mm) 		Half-Bridge
Development
Boards
EPC2055 Single 40 3.6 6.6 2.3 0.7 13 161 LGA 2.5 x 1.5 EPC90132
EPC2020 Single 60 2.2 16 3.9 2.3 50 470 LGA 6.05 x 2.3 EPC9033
EPC2031 Single 60 2.6 16 5.0 3.2 48 450 BGA 4.6 x 2.6 EPC9061
EPC2108 Dual with
Integrated Bootstrap		 60 240
3300		 0.24
0.44		 0.106
0.02		 0.047
0.004		 0.71
0.93
0.134		 5.5
0.5		 BGA 1.35 x 1.35 N/A
EPC2206 Single (AEC-Q101) 80 2.2 15 4.1 3 72 390 LGA 6.05 x 2.3 N/A
EPC2021 Single 80 2.2 15 4.1 3 72 390 LGA 6.05 x 2.3 EPC9034
EPC2029 Single 80 3.2 13 3.4 1.9 53 360 BGA 4.6 x 2.6 EPC9046
EPC2103 Half Bridge 80 5.5 6.5 2.2 1.1 30
34		 195 BGA 6.1 x 2.3 EPC9039
EPC2202 Single (AEC-Q101) 80 17 3.2 1 0.55 18 75 LGA 2.1 x 1.6 N/A
EPC2218 Single 100 3.2 10.5 3.2 1.5 46 231 LGA 3.5 x 1.95 EPC2204
EPC2204 Single 100 6 5.7 1.8 0.8 25 125 LGA 2.5 x 1.5 EPC90123
EPC2104 Half Bridge 100 6.8 6.8 2.3 1.4 35
41		 180 BGA 6.1 x 2.3 EPC9040
EPC2052 Single 100 13.5 3.6 1.5 0.5 13 74 BGA 1.5 x 1.5 EPC9092
EPC2016C Single 100 16 3.4 1.1 0.55 16 75 LGA 2.1 x 1.6 EPC9010C
EPC2051 Single 100 25 1.8 0.6 0.3 7.2 37 BGA 1.3 x 0.85 EPC9091
EPC2007C Single 100 30 1.6 0.6 0.3 8.3 40 LGA 1.7 x 1.1 N/A
EPC2036 Single 100 65 0.7 0.17 0.14 3.9 18 BGA 0.9 x 0.9 EPC9050
EPC2106 Half Bridge 100 70 0.73 0.24 0.140 3.96
4.68		 18 BGA 1.35 x 1.35 EPC9055
EPC2107 Dual with
Integrated Bootstrap		 100 390
3300		 0.19
0.044		 0.077
0.020		 0.041
0.004		 0.9
1.25
0.134		 3.8
0.5		 BGA 1.35 x 1.35 N/A
EPC2033 Single 150 7 12 3.8 3.2 90 260 BGA 4.6 x 2.6 EPC9047
EPC2059 Single 170 9 5.7 1.3 0.9 35 102 BGA 2.8 x 1.4 EPC9098
EPC2215 Single 200 8 13.6 3.3 2.1 69 162 BGA 4.6 x 1.6 EPC9099
EPC2207 Single 200 22 4.5 1.3 0.7 23 54 BGA 2.9 x 0.9 EPC90124
EPC2019 Single 200 50 1.8 0.60 0.35 18 42 LGA 2.8 x 0.95 EPC9014

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