MedTech

eGaN^® FETs and ICs for Medical Technology

Advances in semiconductor technology are resulting in advances in the field of medicine. The high frequency switching speed and small size of GaN are enabling applications such as wireless power transfer. Today, enabled by the emergence of GaN technology, there are major leaps forward in activities such as medical imaging, diagnostic techniques, and human implantable devices. For high voltage lateral GaN transistors, all of the electrical connections are located on the same side of the die, allowing for the elimination of complex, performance limiting two-sided packaging common in vertical Si power MOSFETs. Chip-scale packaging is a more efficient form of packaging that reduces the resistance, inductance, size, thermal impedance, and cost of power transistors, enabling unmatched in-circuit performance.

Application Brief – eGaN FETs and ICs for Medical Technology

eGaN FETs and ICs for Medical Technology
	MedTech Application	eGaN Technology	Benefits
Wireless Power for Implantable Devices	On-patient wireless power applications	EPC2107 100 V, 0.5 A Die size: 1.35 mm x 1.35 mm	eGaN FETs switching speed enables wireless power transfer for implanted devices which eliminates the need for through-skin cables, reducing the mortality rate while making it possible for patients to maintain a quality of life
Imaging Equipment and Diagnostics	Image resolution is critical to MRI scanners		eGaN FETs provide improved scanning speed allowing more coils to be employed, thus reducing distortion of the magnetic field and decreasing overall power consumption for imaging equipment
Imaging Equipment and Diagnostics	Non-invasive “colonoscopy pill” from Check-Cap Ltd	EPC2012C 200 V, 22 A Die size: 1.7 mm x 0.9 mm	eGaN FETs high frequency switching increases performance of X-Ray based diagnostic systems and the FET’s extremely small chipscale packaging enables high energy density
Robots		EPC2039 80 V, 50 A Die size: 1.35 mm x 1.35 mm	GaN’s small size, thermal efficiency and high frequency switching contribute to high resolution motor control for medical robotics

Recommended Devices for Medical Technology Design

Part Number	Configuration	V_DS	Max R_DS(ON) (mΩ) (V_GS = 5 V)	Q_G typ (nC)	Q_GS typ (nC)	Q_GD typ (nC)	Q_OSS typ (nC)	Max. Peak Pulsed I_D(A) (25°C, Tpulse = 300µs)	Package (mm)	Half-Bridge Development Boards
EPC2015C	Single	40	4	8.7	2.7	1.2	19	235	LGA 4.1 x 1.6	EPC9001C
EPC2014C	Single	40	16	2	0.70	0.30	4	60	LGA 1.7 x 1.1	EPC9005C
EPC8004	Single	40	110	0.37	0.120	0.047	0.63	7.5	LGA 2.1 x 0.85	EPC9066
EPC2035	Single	60	45	1	0.25	0.16	1	24	BGA 0.9 x 0.9	EPC9049
EPC2108	Dual with Integrated Bootstrap	60	240 3300	0.24 0.44	0.106 0.02	0.047 0.004	0.71 0.93 0.134	5.5 0.5	BGA 1.35 x 1.35	EPC9509
EPC8009	Single	65	130	0.37	0.120	0.055	0.94	7.5	LGA 2.1 x 0.85	EPC9067
EPC8002	Single	65	480	0.133	0.057	0.015	0.334	2	LGA 2.1 x 0.85	EPC9022
EPC2039	Single	80	25	2.4	0.76	0.42	7.6	50	BGA 1.35 x 1.35	EPC9057
EPC2045	Single	100	7	5.2	1.7	1.1	21	130	BGA 2.5 x 1.5	EPC9078
EPC2001C	Single	100	7	7.5	2.4	1.2	31	150	LGA 4.1 x 1.6	EPC9002C
EPC2016C	Single	100	16	3.4	1.1	0.55	16	75	LGA 2.1 x 1.6	EPC9010C
EPC2007C	Single	100	30	1.6	0.6	0.3	8.3	40	LGA 1.7 x 1.1	EPC9006C
EPC2036	Single	100	65	0.7	0.17	0.14	3.9	18	BGA 0.9 x 0.9	EPC9050
EPC2106	Half Bridge	100	70	0.73	0.24	0.140	3.96 4.68	18	BGA 1.35 x 1.35	EPC9055
EPC8010	Single	100	160	0.36	0.130	0.060	2.2	7.5	LGA 2.1 x 0.85	EPC9068
EPC2107	Dual with Integrated Bootstrap	100	390 3300	0.19 0.044	0.077 0.020	0.041 0.004	0.9 1.25 0.134	3.8 0.5	BGA 1.35 x 1.35	EPC9510
EPC2037	Single	100	550	0.115	0.032	0.025	0.6	2.4	BGA 0.9 x 0.9	EPC9051
EPC2110	Dual, Common Source	120	110	0.8	0.25	0.18	4	20	BGA 1.35 x 1.35	N/A
EPC2047	Single	200	10	8.2	2.9	1.8	60	160	BGA 4.6 x 1.6	EPC9081
EPC2046	Single	200	25	2.9	1	0.6	22	55	BGA 2.77 x 0.95	EPC9079
EPC2010C	Single	200	25	3.7	1.3	0.7	40	90	LGA 3.6 x 1.6	EPC9003C
EPC2012C	Single	200	100	1	0.30	0.20	10	22	LGA 1.7 x 0.9	EPC9004C
EPC2050	Single	350	65	3.4	1.4	0.4	33	26	BGA 1.95 x 1.95	EPC9084