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Thermal Modeling for GaN CSP
Gallium nitride–based high-electron–mobility transistors (HEMTs) have been widely adopted in both consumer and industrial power conversion due to their many material and device advantages over legacy silicon-based converters. The improvements in power-conversion efficiency at much higher switching frequencies that are enabled by GaN can translate to lower system costs and improved power density. Heat dissipation analysis and thermal modeling become critically important as power densities increase. In this article, we will review a thermal calculator tool released by Efficient Power Conversion (EPC). EPC manufactures enhancement-mode GaN HEMTs and integrated power-conversion circuits like half-bridges that form the building blocks of many converters.
Power Electronics News