Optimizing PCB Thermal Design for GaN FETs: A Guide for Power Electronics Engineers

Gallium nitride (GaN) field-effect transistors (FETs) have revolutionized power electronics with their superior performance characteristics. However, like all power devices, heat management remains critical. Effective thermal design at the printed circuit board (PCB) level can substantially improve cooling without the need for a heatsink. This article presents simple thermal management guidelines maximizing heat conduction from the GaN FETs to the environment using just the PCB and optimizes thermal performance without the use of a heatsink.

Power Systems Design
February 2025

Optimizing PCB Thermal Design for GaN FETs: A Guide for Power Electronics Engineers