Scaling AI Power with GaN: Inside the Renesas–EPC Alliance

This session explores how the second‑source and licensing agreement between Renesas and EPC is accelerating GaN adoption in AI data centers, automotive, robotics, and industrial applications. The speakers examine the shift to new “grid‑to‑core” 800 V DC architectures and show how low‑voltage GaN enables higher efficiency and power density. They discuss multi‑sourcing strategies, internal wafer fabrication for low‑voltage GaN, and the crucial role of advanced packaging and thermo‑mechanical reliability. The panel closes with a clear outlook on how this partnership will shape the next generation of GaN‑based power systems.