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In this interview, Episil Group chairman JH Shyu discusses the company’s role as a GaN foundry partner to EPC. He outlines key challenges in GaN manufacturing, including thermal management, dynamic Rds(on) degradation, EMI, and reliability for both AI servers and automotive applications. Shyu highlights scaling from 6‑inch to 8‑ and 12‑inch wafers, the transition toward vertical GaN, and the integration of all‑in‑one GaN power ICs as major milestones reshaping the power electronics industry.