Aug 26, 2025
Gerald Adriano, Director of Package R&D
As gallium nitride (GaN) adoption accelerates in applications from data centers and robotics to automotive and consumer electronics, packaging plays an increasingly critical role. EPC’s thermally enhanced power quad flat no-lead (PQFN) packages deliver the performance and density engineers demand, but success in real-world systems depends on one thing: reliable assembly.
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GaN FETs and ICs
Evaluation Boards
The Growing Ecosystem for eGaN FET Power Conversion (How2AppNote 005)
How to Design an eGaN FET-Based Power Stage with an Optimal Layout (How2AppNote 007)