GaN Talk a blog dedicated to crushing silicon
Term: PCB
2 post(s) found

May 07, 2022

How to Use the GaN FET Thermal Calculator to Boost Reliability and Shorten Time-To-Market in Power Electronics System Designs

Assaad El Helou, Senior Thermal/Mechanical Engineer, Applications Engineering

When “displacement” technologies such as EPC’s GaN power FETs and ICs are introduced and new levels of performance are possible, modeling your design offers comfort and insight to your circuits’ capabilities and needs. This blog post discussed the latest addition to the “EPC GaN Power Bench, our on-line modeling tool library, EPC’s GaN FET Thermal Calculator

Dec 05, 2017

Designing Manufacturable and Reliable Printed Circuit Boards Employing Chip-Scale eGaN FETs

Michael de Rooij, Ph.D., Vice President, Applications Engineering

Written by Michael de Rooij and Alana Nakata - Efficient Power Conversion

Published in: PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management; Proceedings of

eGaN FETs, which are available in non-traditional chip scale packages (CSP) as land grid array (LGA) and/or ball grid array (BGA) formats, have repeatedly demonstrated higher power density and higher efficiency performance than equivalent MOSFETs across various applications [1, 2]. Those improvements are contingent upon proper layout practices documented extensively in [1, 3] that minimize unwanted parasitic elements. Over the seven years since eGaN FETs were first launched into the market there have been a total of 127 device failures out of a total of more than 17 billion hours in actual use in the field, 75 of which were a result of poor assembly technique or poor printed circuit board (PCB) design practices [4]. Designers are becoming more familiar with the PCB design rules that affect manufacturability and are less forgiving compared to MOSFETs due to their relatively smaller sizes. This paper will cover the various guidelines for PCB design that maximize the performance of eGaN FETs and reliability yet still rely on existing PCB manufacturing capabilities.