GaN Talk Blog

As gallium nitride (GaN) adoption accelerates in applications from data centers and robotics to automotive and consumer electronics, packaging plays an increasingly critical role. EPC’s thermally enhanced power quad flat no-lead (PQFN) packages deliver the performance and density engineers demand, but success in real-world systems depends on one thing: reliable assembly.

Learn about what key factors you should consider when selecting a GaN gate driver. Make the best choice for your power electronics design here.

APEC is The Premier Global Event in Applied Power Electronics

Preparations are well underway for EPC to head to Houston for the Applied Power Electronics Conference (APEC). The team is excited to be back, in-person exhibiting a large variety of demonstrations showcasing how the superior performance of GaN is transforming the delivery of power across many industries, including computing, communications, and e-mobility.

Here’s a sneak peek at some of the key application areas we will be showcasing in Booth 1302 at APEC.

Modern displays, such as laptops and PC monitors, typically require a low power boost converter. In this application, the screen intensity is low to moderate and the converter is operated at light load most of the time, so the light-load efficiency is very important. The low switching loss of eGaN FETs can help address this challenge. This GaN Talk will examine the design of a 12 V to 60 V, 50 W DC/DC power module with low temperature rise using eGaN FETs in the simple and low-cost synchronous boost topology.

Power electronics engineers are constantly working towards designs with higher efficiency and higher power density while maintaining high reliability and minimizing cost. Advances in design techniques and improved component technologies enable engineers to consistently achieve these goals. Power semiconductors are at the heart of these designs and their improvements are vital to better performance. In this EPC space blog, we will demonstrate how GaN power semiconductors allow for innovation in the harsh radiation environments of space applications.

GaN power semiconductors offer designers in the high reliability market a sudden and significant improvement in electrical performance over their silicon power MOSFET predecessors. Table 1 compares radiation hardened GaN and Si power semiconductor device characteristics important for circuit designers to increase efficiency and power density in their converter.