GaN Talk Blog

World-changing innovations such as the first video cassette recorder (VCR) in 1970 to the world’s first laptop that can charge wirelessly have been announced at CES, the worlds gathering place for innovation.

World-changing innovations and Gallium Nitride (GaN), a critical building-block component behind many of today’s new and exciting consumer technology innovations such as self-driving cars, robots, drones, wireless power solutions, world-class audio and cutting-edge automotive solutions go hand in hand.

eGaN FETs and ICs enable very high-density power converter design, owing to their compact size, ultra-fast switching, and low on-resistance. The limiting factor for output power in most high-density converters is junction temperature, which prompts the need for more effective thermal design. The chip-scale packaging of eGaN also offers six-sided cooling, with effective heat extraction from the bottom, top, and sides of the die. This application note presents a high-performance thermal solution to extend the output current capability of eGaN-based converters.

This post was originally published by Bill Kleyman on November 5, 2018 on the Data Center Frontier  web site. Learn more about eGaN technology and EPC GaN solutions for the Data Center.

The data center is an ever-changing entity and part of our technological landscape. But sometimes the biggest changes in the colocation industry happen at the core of what makes a data center tick, and may not be visible at first glance. In this instance, we’re talking about data center power, and the potential of creative solutions on the market, such as using Gallium nitride (GaN) in power conversion equipment.

Minimal invasive surgery using surgical robots gives unprecedented control to surgeons looking to achieve the next level of precision, thereby reducing risk and trauma to the patient and speeding recovery. Many motors are required to control the various robotic appendages, such as arms, joints, and tool control, that give the surgical robot the required degrees of freedom (DOF) and dexterity to perform extremely delicate tasks. Weight and size of motor control circuitry are thus important factors in the design of such robots as they directly impact the size of the motor that manipulates the robot’s appendages during surgery.

The motor of choice for robotic surgery is the 3-phase brushless DC (BLDC) motor These motors are compact for their power rating, can be precisely controlled, offer high electro-mechanical efficiency, and can operate with minimal vibration when properly controlled. The choice of motor voltage lies in the range of 24 V to 48 V with balancing power conductor thickness and weight with insulation thickness and stiffness for optimum performance and dexterity being the determining factors.

Motivation

eGaN FETs are capable of switching much faster than Si MOSFETs, requiring more careful consideration of PCB layout design to minimize parasitic inductances. Parasitic inductances cause higher overshoot voltages and slower switching transitions. This application note reviews the key steps to design an optimal power stage layout with eGaN FETs, to avoid these unwanted effects and maximize the converter performance.

Impact of parasitic inductance on switching behavior

As shown in figure 1, three parasitic inductances can limit switching performance 1) power loop inductance (L_loop), 2) gate loop inductance (L_g), and 3) common-source inductance (L_s). The chip-scale package of eGaN FETs eliminates any significant inductance within the transistor itself, leaving the printed circuit board (PCB) as the main contributor. Each parasitic inductance is a consequence of the total area encompassed by the dynamic current path and its return loop. (See WP009: Impact of Parasitics on Performance).

Gab-Su Seo^1,2, Ratul Das¹, and Hanh-Phuc Le^1
1Department of Electrical, Computer, and Energy Engineering, University of Colorado
²Power Systems Engineering Center, National Renewable Energy Laboratory, Colorado, U.S.A.

With drastically increasing demands for cloud computing and big data processing, the electric energy consumption of data centers in the U.S. is expected to reach 73 billion kWh by 2020 [1], which will account for approximately 10% of the U.S total electric energy consumption. A large portion of this consumption is caused by losses from inefficient power delivery architectures that require a lot of attention for improvements [2], [3].

This post, authored by Steve Taranovich, Editor-in-Chief, Planet Analog was originally published August 10, 2018 on the Planet Analog website. Learn more about eGaN technology and EPC GaN solutions for LiDAR.

I have a pathological interest in the promotion of electric vehicles; Formula E racing is one of the most exciting venues for techies like myself. See some of my articles on Formula E in the links at the end of this blog.

What caught my eye recently was a ROBORACE video at a Formula E race track in Rome, Italy:

Enhancement-mode GaN power devices, (eGaN^® FETs and ICs) provide the path for users to differentiate their end products. This new technology gives significantly higher efficiencies in the ever-present power supply and delivery circuits that fuel our gadgets and electronic equipment.

As the sales manager for the Americas, I am in the enviable position of working with customers to create a new vision of excellence so they continue to lead in their market space and contribute optimizing power consumption by reducing energy consumption.

Power systems designs introducing new technologies and approaches is always met with curiosity and evaluation. Customers always ask the most fundamental and far-reaching questions about the attributes and implementation of new technologies. Therefore, I thought documenting the most common questions I have received will help others considering the use of GaN technology pave the way to their confident adoption of this transitional technology.

Ask EPC's chief executive, Alex Lidow, what the future holds for his GaN power device business, and automotive certification features prominently.

Recently delivering AEC Q101-qualified 80 V discrete transistors for LiDAR, 48V power distribution systems and other applications, the company's latest enhancement-mode FETs deliver higher switching frequencies and efficiencies than silicon MOSFETs, in a smaller footprint. And this is just the beginning.

"We have more transistors as well as integrated circuits designed for LiDAR [sensors] and are proceeding with automotive certification here," highlights Lidow. "LiDAR is under intense cost and performance pressure so integrating components and improving performance while lowering the cost is a big deal."

Automotive technology has entered a renaissance with the emergence of autonomous cars and electric propulsion as the driving forces.  IHS Markit estimates that 12 million cars will be autonomous by 2035 and 32 million cars will have electric propulsion according to Bloomberg New Energy Finance, Marklines.  Both trends translate into a large growth in demand for power semiconductors.  This is also happening at a time when silicon is reaching its performance limits in the world of power conversion, thus opening a huge new market for power devices based on gallium nitride grown on a silicon substrate (GaN-on-Si).