The previous installment in this series focused on the physics of failure surrounding thermo-mechanical reliability of EPC eGaN wafer level chip-scale packages. A fundamental understanding of the potential failure modes under voltage bias is also important. This installment will provide an overview of the physics of failure associated with voltage bias at the gate electrode of gallium nitride (GaN) field effect transistors (FETs). Here we look at the case of taking the gate control voltage to the specified limit and beyond to investigate how eGaN FETs behave over a projected lifetime.

Planet Analog
Chris Jakubiec
November 29, 2016
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The world around us will soon be engulfed by machines that affect our living spaces, our bodies, and our experience of light and sound, powered by a novel combination of semiconductors and miniature engines. Tasks as basic as charging a smartphone or cooking an egg—and as complex as scanning for colon cancer or powering flying drones on long journeys—stand to be transformed.

Barron's
October 22, 2016
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Tesla Motors is releasing a new version of Autopilot overnight, adding features the company says will make it safer and more reliable. Investigators are probing what role the self-driving system played in a pair of fatal crashes in Florida and China.

Silicon Beat
September 21, 2016
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Class A has been the serious audiophile's gold standard for decades. Today however, we are at the early stages of a seismic shift towards widespread Class D audiophile adoption. Why? Because a new type of Class D audio is quickly approaching the performance of Class A, with benefits not enjoyed by the reigning incumbent. A new transistor technology called Gallium Nitride (GaN) is poised to uproot the high-end audio world. In fact, GaN-based Class D is much more power-efficient than traditional, MOSFET-based Class D and offers orders of magnitude better performance.

Audiophile Review
September 17, 2016
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The chief technology officer of a technology supplier that enables Tesla's semi-autonomous Autopilot driving technology believes the carmaker is pushing the safety envelope too far.

"It is not designed to cover all possible crash situations in a safe manner," Amnon Shashua, CTO and executive chairman at Israel-based Mobileye NV, told Reuters Wednesday.

Computerworld
September 15, 2016
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In the future, self-driving cars will require laser-based sensing tech, and these systems will need new types of high-speed transistors and chips that can beat out silicon.

That’s the assertion of Alex Lidow, a Stanford PhD physicist, entrepreneur, and CEO and founder of Efficient Power Conversion (commonly called EPC), a company based in El Segundo, Calif. that makes transistors and chips out of a material that operates more quickly and efficiently—and costs less than silicon.

Fortune
September 8, 2016
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The first three installments in this series covered field reliability experience and stress test qualification of EPC’s enhancement-mode gallium nitride (eGaN) field effect transistors (FETs) and integrated circuits (ICs). Excellent field reliability that was documented is the result of applying stress tests covering the intended operating conditions the devices will experience within applications. Of equal importance is understanding the underlying physics of how eGaN devices will fail when stressed beyond intended operating conditions (e.g. datasheet parameters and safe operating area). This installment will take a deeper dive into the physics of failure centered around thermo-mechanical reliability of eGaN wafer level chip-scale packages (WLCSP).

Planet Analog
Chris Jakubiec
September 7, 2016
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EPC Phase Eight Reliability Report documents a combined total of over 8 million GaN device-hours with zero failures. The report examines, in detail, the stress tests that EPC devices are subjected to prior to release as qualified products and analyzes the physics of failure.

Bodo’s Power Systems
September 1, 2016
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Efficient Power Conversion Corporation (EPC) shares the immediate availability of a complete demonstration multi-mode wireless power charging kit, the EPC9121, for simplifying the evaluation process of using eGaN FETs and ICs for highly efficient multi-mode wireless power charging systems that can cut across any standard used in the receiving units.

The superior characteristics of eGaN^® FETs and ICs enable a lower cost single transmit amplifier solution that can wirelessly charge devices regardless of the wireless power standard used in the receiving device.

View video of the latest EPC9121 demo kit with engineers at PCIM Asia 2016, and the related interview

Gallium Nitride ICs: Increasing server power efficiencies - Reducing waste power, cooling, and space aren't just data-center-size concerns; they're also battles fought inside the confines of each rack. And, sometimes, even one small change can make a big difference.

TechBeacon
August 2, 2016
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GaN-based FETs are disrupting the power conversion market and are displacing silicon-based metal–oxide–semiconductor field-effect transistors (MOSFETs). Compared to MOSFETs, GaN FETs operate much faster and have higher switching speeds in the smallest possible volume. The promise of GaN is that it can dramatically reduce the size and weight of any power supply. To reach their performance potential, these high-performance GaN transistors need an optimized gate driver.

Peregrine Semiconductor
July 12, 2016
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The first two installments in this series reported in detail on field reliability experience of Efficient Power Conversion (EPC) Corporation’s enhancement-mode gallium nitride (eGaN^®) FETs and integrated circuits (ICs). The excellent field reliability of eGaN devices demonstrates stress-based qualification testing is capable of ensuring reliability in customer applications. In this installment we will examine the stress tests that EPC devices are subjected to prior to being considered qualified products.

Planet Analog
Chris Jakubiec
July 9, 2016
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Silicon Valley's namesake raw material faces a promising new rival: gallium nitride (GaN). Some say the newcomer is poised to swarm the $30 billion semiconductor power supply market. It's a market that involves "anything that plugs into a wall" ranging from Apple (AAPL) iPhone chargers to Tesla Motors' (TSLA) luxury electric cars.

Investor's Business Daily
Allison Gatlin
July 2016
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Tuesday I was fortunate enough to have a meeting with Alex Lidow, founder of chip company EPC of El Segundo, California, and something of an luminary of the chip world. Lidow came up with the “power MOSFET,” a device that went on to be the basis of billions in semiconductor sales, in 1977.

His new company, whose initials stand for “Efficient Power Conversion,” proposes replacing silicon, the original basis of the MOSFET, and one of the most prevalent types of semiconductor around, with a different material, Gallium Nitride, commonly abbreviated as GaN — or “eGaN,” as Lidow calls the company’s new, improved form of GaN.

Barron's
Tiernan Ray
June 29, 2016
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There have been several comparisons of eGaN FETs with silicon MOSFETs in a variety of applications, including hard-switched, soft-switched, and high-frequency power conversion. These studies have shown that eGaN FETs have large efficiency and power density advantages over silicon MOSFETs. Here we’ll focus on the use of eGaN FETs in synchronous rectifier (SR) applications and the importance of dead-time management. We show that eGaN FETs can dramatically reduce loss due to dead-time in synchronous rectifiers above and beyond the benefits of low RDS(on)and charge.

Power Systems Design
By: Dr. John Glaser & Dr. David Reusch, Efficient Power Conversion
June 13, 2016
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ANDOVER, Mass.—At the front door of Raytheon's Integrated Air Defense Center, there's a reminder of how big microwave electronics used to be—the original microwave oven. The now ever-present kitchen device was invented after a Raytheon engineer discovered his candy bar melted while he was standing near a magnetron used in a radar system the company was developing. Nearly the size of a refrigerator, the original microwave looks like it would cook a whole lot more than whatever was put within its metal grate, which was meant to contain the microwaves from its magnetron.

Ars Technica
June 9, 2016
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The chip giant's execs are leaving the AirFuel Alliance as the company pivots away from PCs, but WiTricity was showing off Dell notebooks using its wireless charging mat at Computex.

ZDNet
Sean Portnoy
June 8, 2016
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For the last three years, Intel has been stoking demand for PCs ahead of the next big buying cycle with the promise that new machines will be totally wireless. “We carry around a lot of wires,” Kirk Skaugen, Intel’s senior PC exec said at Computex Taipei 2015. “We carry about six cables each for our phones, our tablets and our PCs. We want to get rid of all those cables.”

Forbes
Elise Ackerman
June 6, 2016
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With power converters demanding higher power density, transistors must be accommodated in an ever decreasing board space. Beyond gallium nitride based power transistors’ ability to improve electrical efficiency, they must also be more thermally efficient. This article evaluates the thermal performance of chip-scale packaged eGaN^® FETs and compares their in-circuit electrical and thermal performance with state-of-the-art silicon MOSFETs.

Bodo’s Power Systems
David Reusch, Ph.D. and Alex Lidow, Ph.D.
June 1, 2016
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MILPITAS, Calif., May 25, 2016 /PRNewswire/ -- Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions, today announced plans to extend its market leading radiation tolerant portfolio to include Gallium Nitride (GaN) power conversion ICs for satellites and other harsh environment applications.

PR Newswire
May 25, 2016
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